The heat accumulation has become a serious problem due to electronic devices towards high power and intelligence. Highly thermal conductive and electrical insulating polymeric composites are potential to solving the overheating problem of electronic devices. Herein, boron nitride nanosheets (BNNSs) were successfully exfoliated by shear forces generated high pressure. Then, BNNSs and sphere BN (S-BN) were added into the poly-dimethylsiloxane (PDMS) matrix to prepare composites. The thermal conductivity of the BNNSs/PDMS composites achieved 1.16 W m(-1) K-1 at 35 wt% fillers, which is almost 5 times that of pure PDMS and higher than that of S-BN/PDMS composites. The efficient thermal paths were constructed by BNNSs in PDMS matrix leading to e...
Thermally conductive polymer packaging material is of great significance for the thermal management ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
To meet the growing demand for rapid heat dissipation in electronic devices to ensure their reliable...
The rapid development of integrated circuits and electronic devices creates a strong demand for high...
Thermally conductive yet electrically insulating polymer composites are urgently required for therma...
We report here in the fabrication of enhanced thermal conductive pathway nanocomposites of boron nit...
Due to the growing needs of thermal management in modern electronics, high thermal conductive polyme...
A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted l...
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagon...
It has been seen previously that addition of fillers to host material systems can create composites ...
Hexagonal boron nitride nanosheets (BNNSs) are two-dimensional nanomaterials with graphitic-like lay...
Thermally conductive polymer packaging material is of great significance for the thermal management ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
To meet the growing demand for rapid heat dissipation in electronic devices to ensure their reliable...
The rapid development of integrated circuits and electronic devices creates a strong demand for high...
Thermally conductive yet electrically insulating polymer composites are urgently required for therma...
We report here in the fabrication of enhanced thermal conductive pathway nanocomposites of boron nit...
Due to the growing needs of thermal management in modern electronics, high thermal conductive polyme...
A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted l...
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagon...
It has been seen previously that addition of fillers to host material systems can create composites ...
Hexagonal boron nitride nanosheets (BNNSs) are two-dimensional nanomaterials with graphitic-like lay...
Thermally conductive polymer packaging material is of great significance for the thermal management ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...