Thesis (Ph.D.)-University of Natal, Durban, 1988.This thesis proposes a new approach to the design of reliable VLSI interconnects, based on predictive failure models embedded in a software tool for reliability analysis. A method for predicting the failure rate of complex integrated circuit interconnects subject to electromigration, is presented. This method is based on the principle of fracturing an interconnect pattern into a number of statistically independent conductor segments. Five commonly-occurring segment types are identified: straight runs, steps resulting from a discontinuity in the wafer surface, contact windows, vias and bonding pads. The relationship between median time-to-failure (Mtf) of each segment and physical di...
Long-term reliability is a major concern in modern VLSI design. Literature has shown that reliabilit...
The need for high speed, low cost and smaller area has increased the integration of electronic devic...
Thermal effects are becoming a limiting factor in high performance circuit design due to the strong ...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2...
Time dependent dielectric breakdown (TDDB) is one of the important failure mechanisms for Copper (Cu...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
The stringent performance and reliability demands that will accompany the development of next-genera...
Device reliability or lifetime is often non-negotiable and crucial for sensitive applications such a...
This thesis presents a new technique for simulating integrated circuits, called probabilistic simula...
Electromigration is the phenomenon of metal ion mass transport along the grain boundaries when a met...
Electromigration (EM) of the interconnects is a key factor in determining the reliability of an inte...
Integrated circuits have evolved from early transistor technology as a result of the increasing reli...
Abstract. Electromigration (EM) of the interconnects is a key factor in determining the reliability ...
The impact of physical design characteristics on backend dielectric reliability was modeled. The imp...
This thesis describes a project, sponsored by the Admiralty Surface Weapons Establishment (A.S.W.E),...
Long-term reliability is a major concern in modern VLSI design. Literature has shown that reliabilit...
The need for high speed, low cost and smaller area has increased the integration of electronic devic...
Thermal effects are becoming a limiting factor in high performance circuit design due to the strong ...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2...
Time dependent dielectric breakdown (TDDB) is one of the important failure mechanisms for Copper (Cu...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
The stringent performance and reliability demands that will accompany the development of next-genera...
Device reliability or lifetime is often non-negotiable and crucial for sensitive applications such a...
This thesis presents a new technique for simulating integrated circuits, called probabilistic simula...
Electromigration is the phenomenon of metal ion mass transport along the grain boundaries when a met...
Electromigration (EM) of the interconnects is a key factor in determining the reliability of an inte...
Integrated circuits have evolved from early transistor technology as a result of the increasing reli...
Abstract. Electromigration (EM) of the interconnects is a key factor in determining the reliability ...
The impact of physical design characteristics on backend dielectric reliability was modeled. The imp...
This thesis describes a project, sponsored by the Admiralty Surface Weapons Establishment (A.S.W.E),...
Long-term reliability is a major concern in modern VLSI design. Literature has shown that reliabilit...
The need for high speed, low cost and smaller area has increased the integration of electronic devic...
Thermal effects are becoming a limiting factor in high performance circuit design due to the strong ...