ABSTRACT Microchannel devices with channel widths in the range from one micron to several hundred microns have become increasingly important structures for heat transfer applications. This paper will examine several classes of fabrication technologies that are employed in the field. Established technologies, such as bulk and surface micromachining, high aspect ratio machining, and conventional machining have been perfected over the last several decades and are the principal methods of creating microchannel structures. Synthesizing technologies, such as wafer bonding and micromolding techniques, allow these primary structures to be assembled together into working devices or enable high volume, low cost manufacturing using microstructured mas...
As the demand for cooling is increased for high-density powered electronic devices, researchers have...
The currently available microchannel fabrication techniques ranging from various etching methods and...
Increased power densities in VLSI chips have led to a need to develop cooling methods that can cope...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Graduation date: 2011Microchannel arrays are being developed across a wide spectrum of microfluidic ...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
International audienceIn this paper, a literature review of the recent research advances and applica...
International audienceIn this paper, a literature review of the recent research advances and applica...
International audienceIn this paper, a literature review of the recent research advances and applica...
Microchannel heat transfer receives huge interest due to its wide range of applications, since it wa...
Microchannel heat transfer receives huge interest due to its wide range of applications, since it wa...
This study compares micron-scale features of double layer-microchannel heat sink (DLMC) fabrication....
As the demand for cooling is increased for high-density powered electronic devices, researchers have...
The currently available microchannel fabrication techniques ranging from various etching methods and...
Increased power densities in VLSI chips have led to a need to develop cooling methods that can cope...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the ...
Graduation date: 2011Microchannel arrays are being developed across a wide spectrum of microfluidic ...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
International audienceIn this paper, a literature review of the recent research advances and applica...
International audienceIn this paper, a literature review of the recent research advances and applica...
International audienceIn this paper, a literature review of the recent research advances and applica...
Microchannel heat transfer receives huge interest due to its wide range of applications, since it wa...
Microchannel heat transfer receives huge interest due to its wide range of applications, since it wa...
This study compares micron-scale features of double layer-microchannel heat sink (DLMC) fabrication....
As the demand for cooling is increased for high-density powered electronic devices, researchers have...
The currently available microchannel fabrication techniques ranging from various etching methods and...
Increased power densities in VLSI chips have led to a need to develop cooling methods that can cope...