The crystal structure of a NiSi thin-film on a Si substrate and Pd site-substitution in NiSi and the partitioning behavior of Pd for NiSi(Pd)/Si(100) are investigated by x-ray diffraction (XRD), first-principles calculations, and atom-probe tomography (APT). The NiSi layer is a distorted orthorhombic structure from XRD patterns via experiments and calculations. We find that Pd has a strong driving force, 0.72 eV atom À1 , for partitioning from Si into the orthorhombic NiSi layer. The calculated substitutional energies of Pd in NiSi indicate that Pd has a strong preference for Ni sublattice-sites, which is in agreement with concentration profiles determined by APT. Transition-metal silicide thin-films are extensively studied and widely used ...
A theoretical investigation of the Ni-Si(001) and Ni-Si(111) reactive interfaces using electronic ba...
WOS: 000276929600037Nickel di-silicide formation induced by RTA process at 850 degrees C for 60 s in...
Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems a...
Metallic silicides have been used as contact materials on source/drain and gate in metal-oxide semic...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems a...
Epitaxial NiSi2 thin films are formed by annealing of Ni on sulfur-implanted silicon (100). The atom...
Low-resistance and uniform contacts are needed for modern 3-D silicon transistors. The formation of ...
A theoretical investigation of the Ni-Si(001) and Ni-Si(111) reactive interfaces using electronic ba...
WOS: 000276929600037Nickel di-silicide formation induced by RTA process at 850 degrees C for 60 s in...
Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems a...
Metallic silicides have been used as contact materials on source/drain and gate in metal-oxide semic...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
International audienceThe NiSi silicide that forms by reactive diffusion between Ni and Si active re...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
The growth kinetics of NiSi has been evaluated by depositing a Ni film on and Si substrates. X-ray...
Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems a...
Epitaxial NiSi2 thin films are formed by annealing of Ni on sulfur-implanted silicon (100). The atom...
Low-resistance and uniform contacts are needed for modern 3-D silicon transistors. The formation of ...
A theoretical investigation of the Ni-Si(001) and Ni-Si(111) reactive interfaces using electronic ba...
WOS: 000276929600037Nickel di-silicide formation induced by RTA process at 850 degrees C for 60 s in...
Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems a...