ABSTRACT We have developed hydrogenated amorphous silicon (a-Si:H) back contacts to both p-and n-type silicon wafers, and employed them in double-heterojunction solar cells. These contacts are deposited entirely at low temperature (<250°C) and replace the standard diffused or alloyed back-surface-field contacts used in singleheterojunction (front-emitter only) cells. High-quality back contacts require excellent surface passivation, indicated by a low surface recombination velocity of minoritycarriers (S) or a high open-circuit voltage (Voc). The back contact must also provide good conduction for majority carriers to the external circuit, as indicated by a high light I-V fill factor. We use hot-wire chemical vapor deposition (HWCVD) to gr...
The growing interest in using thinner wafers (< 200 μm) requires the development of low temperature ...
International audienceIn this work, we focus on the comprehension and optimization of the rear side ...
The growing interest in using thinner wafers (< 200 µm) requires the development of low temperature ...
We have developed hydrogenated amorphous silicon (a Si:H) back contacts to both p- and n-type silico...
Thin hydrogenated amorphous silicon (a-Si:H) layers deposited by hot-wire chemical vapor deposition ...
Thin hydrogenated amorphous silicon (a-Si:H) layers deposited by hot-wire chemical vapor deposition ...
The growing interest in using thinner wafers (< 200 µm) requires the development of low temperature ...
We study an amorphous/crystalline silicon heterojunction (Si HJ) as a back contact in industrial sta...
Even if p-type silicon is a more common PV material, heterojunction solar cells on p-type c-Si are l...
The growing interest in using thinner wafers (< 200 μm) requires the development of low temperature ...
This paper shows how the amorphous/crystalline silicon technology can be implemented in the interdig...
In this paper we address the fundamental challenge of forming an efficient contact between the p-typ...
In this work we show how the heterostructure technology can have a chance in the challenge of interd...
AbstractThis study deals with the introduction of Point Contact technology to enhance the efficiency...
International audienceIn this work, we focus on the comprehension and optimization of the rear side ...
The growing interest in using thinner wafers (< 200 μm) requires the development of low temperature ...
International audienceIn this work, we focus on the comprehension and optimization of the rear side ...
The growing interest in using thinner wafers (< 200 µm) requires the development of low temperature ...
We have developed hydrogenated amorphous silicon (a Si:H) back contacts to both p- and n-type silico...
Thin hydrogenated amorphous silicon (a-Si:H) layers deposited by hot-wire chemical vapor deposition ...
Thin hydrogenated amorphous silicon (a-Si:H) layers deposited by hot-wire chemical vapor deposition ...
The growing interest in using thinner wafers (< 200 µm) requires the development of low temperature ...
We study an amorphous/crystalline silicon heterojunction (Si HJ) as a back contact in industrial sta...
Even if p-type silicon is a more common PV material, heterojunction solar cells on p-type c-Si are l...
The growing interest in using thinner wafers (< 200 μm) requires the development of low temperature ...
This paper shows how the amorphous/crystalline silicon technology can be implemented in the interdig...
In this paper we address the fundamental challenge of forming an efficient contact between the p-typ...
In this work we show how the heterostructure technology can have a chance in the challenge of interd...
AbstractThis study deals with the introduction of Point Contact technology to enhance the efficiency...
International audienceIn this work, we focus on the comprehension and optimization of the rear side ...
The growing interest in using thinner wafers (< 200 μm) requires the development of low temperature ...
International audienceIn this work, we focus on the comprehension and optimization of the rear side ...
The growing interest in using thinner wafers (< 200 µm) requires the development of low temperature ...