Articles you may be interested in Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory J. Appl. Phys. 104, 02352
We report on a collective body of work wherein we have studied the mass transport phenomena which ar...
In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromig...
Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric ...
The morphological evolution of intragranular voids induced by the surface drift-diffusion under the ...
The morphological evolution of intragranular voids induced by surface drift diffusion under the acti...
The electro-migration behavior of a Sn-Ag solder thin film stripe that is deposited on a glass subst...
The electro-migration behavior of a Sn–Ag solder thin film stripe that is deposited on a glass subst...
This thesis addresses electromigration-induced void dynamics in metallic thin films. This has been a...
The morphological evolution of hillocks at the unpassivated sidewalls of single-crystal metallic thi...
Various physical mechanisms are involved in an electromigration (EM) process occurring in metal thin...
Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above...
This study investigated the effects of electric current and external stress on electromigration of i...
In this study, the effects of electromigration on a solder/copper substrate due to temperature and c...
Electromigration-induced degradation in solder joints can be classified into two types, pancake-type...
Abstract Atomic diffusion, or more specifically, electromigration (EM) and stress migration (SM), ar...
We report on a collective body of work wherein we have studied the mass transport phenomena which ar...
In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromig...
Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric ...
The morphological evolution of intragranular voids induced by the surface drift-diffusion under the ...
The morphological evolution of intragranular voids induced by surface drift diffusion under the acti...
The electro-migration behavior of a Sn-Ag solder thin film stripe that is deposited on a glass subst...
The electro-migration behavior of a Sn–Ag solder thin film stripe that is deposited on a glass subst...
This thesis addresses electromigration-induced void dynamics in metallic thin films. This has been a...
The morphological evolution of hillocks at the unpassivated sidewalls of single-crystal metallic thi...
Various physical mechanisms are involved in an electromigration (EM) process occurring in metal thin...
Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above...
This study investigated the effects of electric current and external stress on electromigration of i...
In this study, the effects of electromigration on a solder/copper substrate due to temperature and c...
Electromigration-induced degradation in solder joints can be classified into two types, pancake-type...
Abstract Atomic diffusion, or more specifically, electromigration (EM) and stress migration (SM), ar...
We report on a collective body of work wherein we have studied the mass transport phenomena which ar...
In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromig...
Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric ...
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