Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4 is investigated. Hall effect measurements show higher impact Of Si3N4 than SiO2 passivation on the carrier concentration increase in the channel. Improvements in DC performance of HEMTs after passivation with SiO2 and Si3N4 correspond to the changes in sheet carrier concentration. Small signal microwave characterisation shows a decrease (from 18.6 to 9 GHz) and an increase (from 18.4 to 28.8 GHz) of the current gain cut off frequency after SiO2 and Si3N4 passivation, respectively. Similar effect of passivation is found in microwave power changes-only about a half of the power is obtained aft...
peer reviewedConductivity and Hall effect measurements were performed before and after Si3N4 passiva...
Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of inten...
Despite the considerable improvement in GaN-technology and material quality, RF-dispersion is still ...
Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMT...
Different influence Of SiO2 and SO4 passivation on performance of AlGaN/GaN/Si HEMTs is reported. DC...
Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. ...
Intentionally undoped and three different, doped layer structures are used to investigate properties...
This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mob...
ABSTRACT — AlGaN/GaN high electron mobility transistors (HEMTS on SiC) were characterized before and...
This paper reports on the use of plasma assisted molecular beam epitaxy of AlGaN/GaN high electron m...
Surface passivation effects were studied on AlGaN/GaN high-electron-mobility transistors (HEMTs) usi...
AlGaN/GaN high electron mobility transistors (HEMTS on SiC) were characterized before and after Si...
The phenomenon of current collapse is a limiting factor in the performance of AlGaN/GaN high electro...
The AlGaN/GaN High Electron Mobility Transistor (HEMT) on Silicon Carbide (SiC) substrate with SiO2 ...
Initially, advances in the high frequency markets were begun by work in Gallium Arsenide systems. In...
peer reviewedConductivity and Hall effect measurements were performed before and after Si3N4 passiva...
Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of inten...
Despite the considerable improvement in GaN-technology and material quality, RF-dispersion is still ...
Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMT...
Different influence Of SiO2 and SO4 passivation on performance of AlGaN/GaN/Si HEMTs is reported. DC...
Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. ...
Intentionally undoped and three different, doped layer structures are used to investigate properties...
This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mob...
ABSTRACT — AlGaN/GaN high electron mobility transistors (HEMTS on SiC) were characterized before and...
This paper reports on the use of plasma assisted molecular beam epitaxy of AlGaN/GaN high electron m...
Surface passivation effects were studied on AlGaN/GaN high-electron-mobility transistors (HEMTs) usi...
AlGaN/GaN high electron mobility transistors (HEMTS on SiC) were characterized before and after Si...
The phenomenon of current collapse is a limiting factor in the performance of AlGaN/GaN high electro...
The AlGaN/GaN High Electron Mobility Transistor (HEMT) on Silicon Carbide (SiC) substrate with SiO2 ...
Initially, advances in the high frequency markets were begun by work in Gallium Arsenide systems. In...
peer reviewedConductivity and Hall effect measurements were performed before and after Si3N4 passiva...
Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of inten...
Despite the considerable improvement in GaN-technology and material quality, RF-dispersion is still ...