Due to its low resistivity, high scalability and high thermal stability, CoSi$_{2}$ is widely used as a contact and interconnect material in silicon microelctronics. In this thesis a self-assembly process for fabrication of CoSi$_{2}$-nanostructures is investigated. These structures can be used as building blocks for advanced microelectronic devices. The process is based on anisotropic diffusion in a stress field generated along the edge of a mask consisting of SiO$_{2}$ and Si$_{3}$N$_{4}$. Using local oxidation narrow wires and uniform gaps with dimensions down to 20 nm were produced from 20-30 nm thick single-crystalline, epitaxial CoSi$_{2}$-layers. Gaps with dimensions of approximately 100 nm were generated during the silicide formatio...
We have developed a method for fabricating epitaxial CoSi2 nanowires using only conventional optical...
We have developed a method for fabricatingepitaxialCoSi₂nanowires using only conventional optical li...
Metal silicides are widely used in microelectronics as contact materials and interconnects.Compared ...
seiner hohen Skalierbarkeit und der hohen thermischen Stabilitaet in der integrierten Mikroelektroni...
CoSi2-nanostructures were fabricated using a self-assembly process involving local oxidation of sili...
CoSi2-nanostructures were fabricated using a self-assembly process involving local oxidation of sili...
A self-assembly patterning method for generation of epitaxial CoSi 2 nanostructures was used to fabr...
A new self-assembly patterning method for generation of epitaxial CoSi2 nanostructures was used to f...
A self-assembly patterning method for generation of epitaxial CoSi2 nanostructures was used to fabri...
A patterning method for the generation of epitaxialCoSi₂nanostructures was developed based on anisot...
A self-assembly nanopatterning method for epitaxial-CoSi2 layers has been developed and investigated...
We have investigated a self-assembly process for patterning epitaxial CoSi2, nanowires using local o...
Metal silicides are widely used as interconnect materials in integrated silicon circuits. Because of...
We have developed a self-assembly method for patterning thin CoSi2 layers on Si(100) during their fo...
Metal silicides are widely used as interconnect materials in integrated silicon circuits. Because of...
We have developed a method for fabricating epitaxial CoSi2 nanowires using only conventional optical...
We have developed a method for fabricatingepitaxialCoSi₂nanowires using only conventional optical li...
Metal silicides are widely used in microelectronics as contact materials and interconnects.Compared ...
seiner hohen Skalierbarkeit und der hohen thermischen Stabilitaet in der integrierten Mikroelektroni...
CoSi2-nanostructures were fabricated using a self-assembly process involving local oxidation of sili...
CoSi2-nanostructures were fabricated using a self-assembly process involving local oxidation of sili...
A self-assembly patterning method for generation of epitaxial CoSi 2 nanostructures was used to fabr...
A new self-assembly patterning method for generation of epitaxial CoSi2 nanostructures was used to f...
A self-assembly patterning method for generation of epitaxial CoSi2 nanostructures was used to fabri...
A patterning method for the generation of epitaxialCoSi₂nanostructures was developed based on anisot...
A self-assembly nanopatterning method for epitaxial-CoSi2 layers has been developed and investigated...
We have investigated a self-assembly process for patterning epitaxial CoSi2, nanowires using local o...
Metal silicides are widely used as interconnect materials in integrated silicon circuits. Because of...
We have developed a self-assembly method for patterning thin CoSi2 layers on Si(100) during their fo...
Metal silicides are widely used as interconnect materials in integrated silicon circuits. Because of...
We have developed a method for fabricating epitaxial CoSi2 nanowires using only conventional optical...
We have developed a method for fabricatingepitaxialCoSi₂nanowires using only conventional optical li...
Metal silicides are widely used in microelectronics as contact materials and interconnects.Compared ...