© 2015 IEEE. As the very large scale integration (VLSI) technology enters the nanoscale regime, VLSI design is increasingly sensitive to variations on process, voltage, and temperature. Layer assignment technology plays a crucial role in industrial VLSI design flow. However, existing layer assignment approaches have largely ignored these variations, which can lead to significant timing violations. To address this issue, a variation-aware layer assignment approach for cost minimization is proposed in this paper. The proposed layer assignment approach is a single-stage stochastic program that directly controls the timing yield via a single parameter, and it is solved using Monte Carlo simulations and the Latin hypercube sampling technique. A ...
Current advanced transistor architectures, such as FinFETs and (stacked) nanowires and nanosheets, e...
As VLSI technology moves to the 65nm node and beyond, interconnect delay greatly limits the circuit ...
UnrestrictedWith the progress in today’s semiconductor technology, the chip density and operating fr...
As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit...
As VLSI technology enters the nanoscale regime, the interconnect delay becomes the bottleneck of cir...
2011-11-22In today’s IC design, one of the key challenges is the increase in power consumption of th...
Technology scaling has increased the transistor\u27s susceptibility to process variations in nanomet...
In this paper, we present a layer assignment method for high-performance multi-chip module environme...
DoctorAggressive technology scaling makes the process variations a significant problem in VLSI desig...
The multi-net Global Routing Problem (GRP) in VLSI physical design is a problem of routing a set of ...
As integrated-circuit technology continues to scale, process variation is becoming an issue that can...
In modern deep scaled CMOS ICs, the process, voltage and temperature (PVT) variations result to a ra...
As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging d...
Abstract — Design variability due to within-die and die-to-die variations has potential to significa...
Today's IC design is facing several challenges due to increasing circuit complexity and decreasing f...
Current advanced transistor architectures, such as FinFETs and (stacked) nanowires and nanosheets, e...
As VLSI technology moves to the 65nm node and beyond, interconnect delay greatly limits the circuit ...
UnrestrictedWith the progress in today’s semiconductor technology, the chip density and operating fr...
As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit...
As VLSI technology enters the nanoscale regime, the interconnect delay becomes the bottleneck of cir...
2011-11-22In today’s IC design, one of the key challenges is the increase in power consumption of th...
Technology scaling has increased the transistor\u27s susceptibility to process variations in nanomet...
In this paper, we present a layer assignment method for high-performance multi-chip module environme...
DoctorAggressive technology scaling makes the process variations a significant problem in VLSI desig...
The multi-net Global Routing Problem (GRP) in VLSI physical design is a problem of routing a set of ...
As integrated-circuit technology continues to scale, process variation is becoming an issue that can...
In modern deep scaled CMOS ICs, the process, voltage and temperature (PVT) variations result to a ra...
As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging d...
Abstract — Design variability due to within-die and die-to-die variations has potential to significa...
Today's IC design is facing several challenges due to increasing circuit complexity and decreasing f...
Current advanced transistor architectures, such as FinFETs and (stacked) nanowires and nanosheets, e...
As VLSI technology moves to the 65nm node and beyond, interconnect delay greatly limits the circuit ...
UnrestrictedWith the progress in today’s semiconductor technology, the chip density and operating fr...