Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay performance degradation, and induced signal interference due to coupling capacitance between adjacent wires on the bus. This paper proposes a novel encoding scheme to, further, reduce the coupling energy dissipation, and delay. Further, the energy cost of the overhead encoding scheme in our proposed scheme is significantly reduced. We present an 8-bit to 10-bit equivalent solution that reduces the energy dissipation by 55%, delay by 24%, and energy delay product by 65%, without any additional area penalty on the bus. It also requires much less complex codec circuitry requiring 96% less area overhead, when compared with transition pattern coding (...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
Abstract. Crosstalk causes logical errors due to data dependent delay degrada-tion as well as energy...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
Abstract. Crosstalk causes logical errors due to data dependent delay degrada-tion as well as energy...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...