© 2014 IEEE. As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Single-walled carbon nanotubes (SWCNTs) bundle interconnects have emerged as a promising replacement material for copper interconnects due to their superior conductivity. Previous works have focused on studying device and interconnect modeling for bundled SWCNTs while none of them consider deployment of such an advanced technology into VLSI physical design. To the best of the authors\u27 knowledge, this paper develops the first physical design technique for the interconnect optimization using carbon nanotube interconnects. We propose ...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
A robust design of the propagation characteristics of interconnect structures based on multiwall car...
In nanoscale regime as the CMOS process technology continues to scale, the standard copper (Cu) inte...
© 2016 World Scientific Publishing Company. While copper interconnect scaling is approaching its fun...
In the nanoscale technology, both the device and interconnect performances affect the overall perfor...
The heterogeneous system architecture which leverages multicore computing paradigm has become increa...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
This paper investigates the performance of bundles of Single Wall Carbon Nanotubes (SWCNT) for low-p...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
In this paper present the performance analysis of two possible realizations of a CNT-based nano-inte...
As prevailing copper interconnect technology advances to its fundamental physical limit, interconnec...
In future nanoscale integrated circuits, process technology scaling coupled with increasing operatin...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size ...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
A robust design of the propagation characteristics of interconnect structures based on multiwall car...
In nanoscale regime as the CMOS process technology continues to scale, the standard copper (Cu) inte...
© 2016 World Scientific Publishing Company. While copper interconnect scaling is approaching its fun...
In the nanoscale technology, both the device and interconnect performances affect the overall perfor...
The heterogeneous system architecture which leverages multicore computing paradigm has become increa...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
This paper investigates the performance of bundles of Single Wall Carbon Nanotubes (SWCNT) for low-p...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
In this paper present the performance analysis of two possible realizations of a CNT-based nano-inte...
As prevailing copper interconnect technology advances to its fundamental physical limit, interconnec...
In future nanoscale integrated circuits, process technology scaling coupled with increasing operatin...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size ...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
A robust design of the propagation characteristics of interconnect structures based on multiwall car...
In nanoscale regime as the CMOS process technology continues to scale, the standard copper (Cu) inte...