This research investigates the fracture of the native oxide layer on an aluminum bonding pad and aluminum wire during ultrasonic wedge bonding. Three different models are used in the approach: a 2D global finite element method (FEM) model, a separate micromechanical oxide film breakage model, and a FEM unit cell model. The 2D global FEM model provides stress data to be input into the other two models while the micromechanical oxide film breakage model predicts the level of oxide fracture and the unit cell model investigates the underlying assumptions of the oxide film breakage model. The oxide film breakage model shows slightly more breakup in peripheral regions for the pad’s oxide layer initially before achieving an even aspect ratio throu...
Metal oxide coating with a nanometer scale thickness on flexible polymer substrates is a viable mate...
The barrier properties of metal oxide coatings deposited on polymer substrates is of interest in pac...
The influence of sharp notches in the interface of directly bonded components, of the oxide layer th...
The effects of the process parameters of ultrasonic power and normal bonding force on bond formation...
Wire-bonding is and will stay one of the essential interconnection methods in electronic packaging. ...
For an assessment of the stresses occurring during ball bonding of high-voltage CMOS chips in a stru...
Research on wire bonding, the most common chip interconnection technology, has been done for over 40...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal mi...
Advani, Suresh G.Gillespie Jr., John W.Ultrasonic consolidation (UC) is a solid state bonding proces...
A dislocation density-based constitutive model has been developed and implemented into a crystal pla...
A dislocation density based constitutive model has been developed and implemented into a crystal pl...
A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial ...
The wedge microstructure of AlSi1 wire bonds as well as the interface between the bonding wire and t...
Für die modellhafte Beschreibung des Drahtbondvorganges in Abhängigkeit von den Bondparametern ist s...
Ultrasonic consolidation process is a rapid manufacturing process used to join thin layers of metal ...
Metal oxide coating with a nanometer scale thickness on flexible polymer substrates is a viable mate...
The barrier properties of metal oxide coatings deposited on polymer substrates is of interest in pac...
The influence of sharp notches in the interface of directly bonded components, of the oxide layer th...
The effects of the process parameters of ultrasonic power and normal bonding force on bond formation...
Wire-bonding is and will stay one of the essential interconnection methods in electronic packaging. ...
For an assessment of the stresses occurring during ball bonding of high-voltage CMOS chips in a stru...
Research on wire bonding, the most common chip interconnection technology, has been done for over 40...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal mi...
Advani, Suresh G.Gillespie Jr., John W.Ultrasonic consolidation (UC) is a solid state bonding proces...
A dislocation density-based constitutive model has been developed and implemented into a crystal pla...
A dislocation density based constitutive model has been developed and implemented into a crystal pl...
A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial ...
The wedge microstructure of AlSi1 wire bonds as well as the interface between the bonding wire and t...
Für die modellhafte Beschreibung des Drahtbondvorganges in Abhängigkeit von den Bondparametern ist s...
Ultrasonic consolidation process is a rapid manufacturing process used to join thin layers of metal ...
Metal oxide coating with a nanometer scale thickness on flexible polymer substrates is a viable mate...
The barrier properties of metal oxide coatings deposited on polymer substrates is of interest in pac...
The influence of sharp notches in the interface of directly bonded components, of the oxide layer th...