Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
- Mertens, P.
- Kim, T.
- Claes, M.
- Le, Q.T.
- Vereecke, G.
- Kesters, E.
- Suchard, S.
- Pacco, A.
- Lux, M.
- Kenis, K.
- Urbanowicz, Adam
- Tokei, Z.
- Beyer, G.
Publication date
June 2009
DOI Publisher
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnectsAbstract
Link to conference program: http://www.his.com/~iitc/techprogram09.htmlThe critical challenges of removal of post metal hard mask etch photo resist removal and post low-k etch residue removal are described. An overview of some new nonplasma based approaches is presented.status: publishe
Add to ORKG