In this paper, a review of the existing special bonding techniques for medium voltage (MV) and high-voltage (HV) cables is presented. Special bonding techniques have the purpose of reducing sheath currents, thereby limiting copper losses and the reduction of the ampacity of cables. The authors present a literature review to identify various bonding techniques and how these have evolved over the years thanks to new technologies. Simulations of the most used techniques have been performed in Matlab/Simulink, to compare their strengths and drawbacks
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the ch...
This critical volume provides an in-depth presentation of copper wire bonding technologies, processe...
Abstract- This paper describes sheath voltage limiter(SVL) transient characteristics by switching ov...
In this paper, a review of the existing special bonding techniques for medium voltage (MV) and high-...
In this article, a review of the existing special bonding techniques for medium voltage and high-vol...
In this paper, the implementation of a simulation model for studying the effect of cross-bonding of ...
Among all failures in cable circuits, the failure rate of cable joints is much higher than that in c...
In this article, the authors discuss a simulation model to study the effect of cross-bonding of meta...
(ENG)The overvoltages between screens of the sectionalized joints depend not only on the chosen surg...
This paper considers electric shock hazard due to induced sheath voltages in 110 kV power cables. Th...
The distribution cables can be operated with their metallic screens in solid bonding (bonded and ear...
Underground links with insulated cables will be introduced in close future in the overhead grid for ...
On-line monitoring is now getting more focus on detecting defects in HV insulated cable system in or...
Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and...
This paper describes and analyses the extra-high voltage double-circuit cable line between Sicily an...
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the ch...
This critical volume provides an in-depth presentation of copper wire bonding technologies, processe...
Abstract- This paper describes sheath voltage limiter(SVL) transient characteristics by switching ov...
In this paper, a review of the existing special bonding techniques for medium voltage (MV) and high-...
In this article, a review of the existing special bonding techniques for medium voltage and high-vol...
In this paper, the implementation of a simulation model for studying the effect of cross-bonding of ...
Among all failures in cable circuits, the failure rate of cable joints is much higher than that in c...
In this article, the authors discuss a simulation model to study the effect of cross-bonding of meta...
(ENG)The overvoltages between screens of the sectionalized joints depend not only on the chosen surg...
This paper considers electric shock hazard due to induced sheath voltages in 110 kV power cables. Th...
The distribution cables can be operated with their metallic screens in solid bonding (bonded and ear...
Underground links with insulated cables will be introduced in close future in the overhead grid for ...
On-line monitoring is now getting more focus on detecting defects in HV insulated cable system in or...
Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and...
This paper describes and analyses the extra-high voltage double-circuit cable line between Sicily an...
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the ch...
This critical volume provides an in-depth presentation of copper wire bonding technologies, processe...
Abstract- This paper describes sheath voltage limiter(SVL) transient characteristics by switching ov...