利用田口實驗分析晶圓製程靜電式晶圓座(ESC)使偏移改善參數優化研究

In the wafer fabrication process, there is a need for the wafer to be restrain within the chamber, the most common practice is the usage of electrostatic chuck (ESC) to hold the wafer. ESC makes use of the static energy between the wafer & chuck to hold the wafer, the principles is to apply voltage to the chuck electrode, causing the chuck to produce static energy,resulting in a chucking force between the wafer & ESC surface thus holding the wafer stationary. After wafer processing is completed, applying a reverse polarity voltage will neutralize the wafer surface static load, attaining fast chucking release and wafer processing throughput. If the polarity voltage switching is not optimized, there is a tendency of wafer scratch, drag & even wafer broken. This will not only increase the manufacturing process and cost, but also reduce the ESC lifetime. This paperisafter theprocessis completed, ESC duringdechuck step usingTaguchi Method to tuning variable parameter, after that dothe experimentaldataanalysisto reduce abnormal wafer pick up afterwafer processis completed. So can achieveproduction equipmentstability, reduce product lossand minimize cost.IC 晶圓製造過程中，需將晶圓固定於腔體內的載具固定之，而目前業界較常使用的設備為靜電式晶圓座(Electrostatic Chuck , ESC)來作為承載晶圓的載具。ESC 利用晶圓與承載具之間的靜電力來吸附晶圓，其原理是當ESC 作用時，會施加一電極電壓來產生靜電吸附的作用，使晶圓座上的介電層產生靜電力進而令晶圓與靜電式晶圓座之間產生吸附力與固定作用。而製程完畢後會再施加一相反的電極電壓來消除晶圓表面的靜電電荷，以達到快速釋放晶圓增加製程速度。但若這相反電極電荷設定不完善時，容易產生晶圓划片，拖片，甚至導致晶圓破片，這不但會增加生產過程的時間及成本提高，也易使ESC 的壽命減低，本文即是ESC 在製程完成後，在Dchuck 的步驟過程中，以田口實驗方法調整變異數分析，再以實驗數據分析進而改善晶圓製程完成後取片異常的現象，以達到生產設備穩定，產品損失降低及成本減少。致謝...................................................i 摘要...................................................ii 英文摘要...............................................iii 目錄...................................................iv 圖表目次................................................vi 第一章 緒論 ..........................................1 1.1 前言 ..........................................1 1.2 研究目的與動機 .................................1 1.3 文獻回顧.......................................2 1.4 論文架構.......................................3 第二章 機台及靜電式晶圓座簡介與工作原理..................4 2.1機台構造及特徵.......................................5 2.2 Electrostatic Chuck 工作原理及簡介..................10 2.2.1靜電式晶圓座簡介...................................10 2.2.2靜電式晶圓座的製造與設計............................11 2.2.3靜電式晶圓座理論...................................14 2.2.4 Chuck & Dechuck理論 .........................19 2.3.4.1 1 Electrostatic Chuck 理論分析.......20 第三章 參數設定及實驗方法 .............................23 3.1實驗步驟及方法.......................................23 3.1.1實驗流程 .....................................24 3.1.2晶圓探測器之功能 ..............................26 3.2實驗架構與流程 ......................................27 3.3 研究內容 ..........................................31 第四章 實驗結果分析與討論..............................38 4.1實驗結果分析 ........................................38 4.2實驗結果討論 ........................................46 第五章 結論與未來展望..................................50 5.1結論 ...............................................50 5.2.未來展望 ..........................................51 參考文獻...............................................5