The thermomechanical integrity of all types of multilayers, bonded joints or laminates is primarily controlled by the adherence between layers. The natural way to improve adherence is by improving the physico-chemical or mechanical adhesion or by working on the intrinsic toughness of the adhesive/glue used to join layers. But, sometimes, the intrinsic interface toughness is limited by processing, chemical or physical difficulties. In such circumstances, different extrinsic solutions are available to increase the energy dissipated during crack propagation. A first option is to play with the plastic dissipation inside the adhesive joint. Here, we will describe the results of a recent study showing the importance of the softening effect inside...
In this paper, the plane-strain finite deformations near the tip of a blunted crack between a viscop...
An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich,...
Adhesion and delamination have been pervasive problems hampering the performance and reliability of ...
The effect on an interlayer on the toughness of an interface between a ductile thin film and an elas...
Adhesive bonding consists in the joining of two adherents by an adhesive, typically made of glassy t...
The mode I fracture toughness of an interface between an adhesive material exhibiting strain-softeni...
Molecular bonding plays an important role in the toolkit of micro-fabrication techniques used for th...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
Crack propagation along one of the interfaces between a thin ductile adhesive layer and the elastic ...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The...
Cohesive-zone models have been used to study the effects of strength and toughness on the delaminati...
The problem of determining whether a crack impinging on an interface will penetrate into the substra...
The fracture process of a laminate is analysed. The laminate is a material used for packaging. It co...
Many complex structures such as airplanes are made of dissimilar materials, combining for instance C...
In this paper, the plane-strain finite deformations near the tip of a blunted crack between a viscop...
An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich,...
Adhesion and delamination have been pervasive problems hampering the performance and reliability of ...
The effect on an interlayer on the toughness of an interface between a ductile thin film and an elas...
Adhesive bonding consists in the joining of two adherents by an adhesive, typically made of glassy t...
The mode I fracture toughness of an interface between an adhesive material exhibiting strain-softeni...
Molecular bonding plays an important role in the toolkit of micro-fabrication techniques used for th...
It is common practice for polymer-metal interfaces, frequently encountered in microelectronic device...
Crack propagation along one of the interfaces between a thin ductile adhesive layer and the elastic ...
Macroscopic delamination of polymer-metal interfaces is one of the main failure modes observed in mi...
Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The...
Cohesive-zone models have been used to study the effects of strength and toughness on the delaminati...
The problem of determining whether a crack impinging on an interface will penetrate into the substra...
The fracture process of a laminate is analysed. The laminate is a material used for packaging. It co...
Many complex structures such as airplanes are made of dissimilar materials, combining for instance C...
In this paper, the plane-strain finite deformations near the tip of a blunted crack between a viscop...
An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich,...
Adhesion and delamination have been pervasive problems hampering the performance and reliability of ...