Add to ORKGThe present investigation deals with the electrodeposition of tin from chloride electrolytes. Gelatin, b-naphthol, polyethylene glycol, peptone and histidine were used as additives in the plating bath to improve the surface morphology, grain size, smoothness and corrosion resistance of the tin deposits. XRD data obtained for electrodeposited tin show polycrystalline nature with single b-phase and tetragonal structure. A uniform and pore free surface was observed under SEM analysis. AFM results indicate the grain refining brought about by the additives. Corrosion rate measurements using the Tafel extrapolation method and electrochemical impedance spectroscopy reveal the increased corrosion resistance from baths containing additi...
Copper-tin electrodeposits are used in protective and decorative finishing of metals. For the commer...
Polarization techniques are used for testing the impact of different compounds (additives) on tinpla...
Sn-Fe thin films were electrodeposited by constant current deposition on copper substrates using an ...
Abstract: The efects of additives on the stannous reduction of an acid sulfate bath were investigate...
Basic electrochemical experiments on the kinetics of tin deposition from an acid sulfate solution co...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
Abstract: The aim of the present study was to improve an electrochemical deposition bath for tin coa...
β-naphthol was one of the first additives introduced for smooth and homogeneous tin electrodepositio...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The kinetics of the electrodeposition of tin were studied f rom simple acid solutions containing var...
A summary of the conditions for alloy electrodeposition follows a brief introduction which includes ...
A neutral gluconate plating bath was developed which offered a silvery white, compact deposit. The d...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The effects of additives on the electrodeposition of Zn–Sn alloy from aqueous electrolyte have been ...
A high efficiency methane sulfonic acid electrolyte used for tin electrodeposition was studied, and ...
Copper-tin electrodeposits are used in protective and decorative finishing of metals. For the commer...
Polarization techniques are used for testing the impact of different compounds (additives) on tinpla...
Sn-Fe thin films were electrodeposited by constant current deposition on copper substrates using an ...
Abstract: The efects of additives on the stannous reduction of an acid sulfate bath were investigate...
Basic electrochemical experiments on the kinetics of tin deposition from an acid sulfate solution co...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
Abstract: The aim of the present study was to improve an electrochemical deposition bath for tin coa...
β-naphthol was one of the first additives introduced for smooth and homogeneous tin electrodepositio...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The kinetics of the electrodeposition of tin were studied f rom simple acid solutions containing var...
A summary of the conditions for alloy electrodeposition follows a brief introduction which includes ...
A neutral gluconate plating bath was developed which offered a silvery white, compact deposit. The d...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The effects of additives on the electrodeposition of Zn–Sn alloy from aqueous electrolyte have been ...
A high efficiency methane sulfonic acid electrolyte used for tin electrodeposition was studied, and ...
Copper-tin electrodeposits are used in protective and decorative finishing of metals. For the commer...
Polarization techniques are used for testing the impact of different compounds (additives) on tinpla...
Sn-Fe thin films were electrodeposited by constant current deposition on copper substrates using an ...