The presentation conclude that thick SOI MEMS are on the market, possibility to build high quality integrated sensors and actuators based on CMOS materials, cointegration of bulk and surface micromachined MEMS with their associated SOI CMOS electronics, internal stress in thin films is of interest to and build-up 3D MEMS and develop nanomechanical testing lab-on-chip
Multilayered self-assembled microstructures are built based on thin-film silicon-on-insulator (SOI) ...
Over the past 20 years, thick-film (screen printed) technology has been shown to possess a variety o...
A post CMOS fabrication process for integrating high aspect ratio MEMS devices with signal processin...
Silicon-on-Insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
Silicon-on-insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
A complementary metal-oxide-semiconductor (CMOS)-compatible one-mask process for the design and fabr...
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities fo...
Silicon-on-Insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
Co-integration of sensors with their associated electronics on a single silicon chip may provide man...
This last decade silicon-on-insulator (SOI) MOSFET technology has demonstrated its potentialities fo...
Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simp...
Surface Micromachining is called so because instead of crystal silicon substrate as functioning mate...
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market...
This paper reviews CMOS (complementary metal-oxide-semiconductor) MEMS (micro-electro-mechanical sys...
Performance expectations for microelectromechanical systems (MEMS), the central building blocks of s...
Multilayered self-assembled microstructures are built based on thin-film silicon-on-insulator (SOI) ...
Over the past 20 years, thick-film (screen printed) technology has been shown to possess a variety o...
A post CMOS fabrication process for integrating high aspect ratio MEMS devices with signal processin...
Silicon-on-Insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
Silicon-on-insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
A complementary metal-oxide-semiconductor (CMOS)-compatible one-mask process for the design and fabr...
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities fo...
Silicon-on-Insulator (SOI) technology is emerging as a major contender for heterogeneous microsystem...
Co-integration of sensors with their associated electronics on a single silicon chip may provide man...
This last decade silicon-on-insulator (SOI) MOSFET technology has demonstrated its potentialities fo...
Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simp...
Surface Micromachining is called so because instead of crystal silicon substrate as functioning mate...
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market...
This paper reviews CMOS (complementary metal-oxide-semiconductor) MEMS (micro-electro-mechanical sys...
Performance expectations for microelectromechanical systems (MEMS), the central building blocks of s...
Multilayered self-assembled microstructures are built based on thin-film silicon-on-insulator (SOI) ...
Over the past 20 years, thick-film (screen printed) technology has been shown to possess a variety o...
A post CMOS fabrication process for integrating high aspect ratio MEMS devices with signal processin...