We report a simple, low-cost and novel method for constructing three-dimensional (3D) microelectrodes in microfluidic system by utilizing low melting point metal alloy. Three-dimensional electrodes have unique properties in application of cell lysis, electro-osmosis, electroporation and dielectrophoresis. The fabrication process involves conventional photolithography and sputtering techniques to fabricate planar electrodes, positioning bismuth (Bi) alloy microspheres at the sidewall of PDMS channel, plasma bonding and low temperature annealing to improve electrical connection between metal microspheres and planar electrodes. Compared to other fabrication methods for 3D electrodes, the presented one does not require rigorous experimental con...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...
we developed a simple, low-cost and novel method for constructing three dimensional (3D) microelectr...
A new microfabrication technology capable of electro-depositing truly three dimensional metal micro-...
Abstract—Silicon-micromachining techniques have been com-bined with conventional material-synthesis ...
This work describes a convenient, fast and low cost method of embedding a high-conductive and ...
This work describes a convenient, fast and low cost method of embedding a high-conductive and ...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...
we developed a simple, low-cost and novel method for constructing three dimensional (3D) microelectr...
A new microfabrication technology capable of electro-depositing truly three dimensional metal micro-...
Abstract—Silicon-micromachining techniques have been com-bined with conventional material-synthesis ...
This work describes a convenient, fast and low cost method of embedding a high-conductive and ...
This work describes a convenient, fast and low cost method of embedding a high-conductive and ...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, wh...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...
This communication describes a simple, rapid and cost effective method of embedding a conductive and...
Many applications of microfluidic devices require the incorporation of electrodes. In this paper, we...