Thanks to the IT technologies, our living−standard has improved greatly. Electronic devices thus become indispensable for our daily life. Because of that, people pay more attention to the problem of heat dissipation, as the heat management becomes challenging due to the limiting size of the device. Industries normally apply thermal grease between the thermocouple and heat sink, in order to enhance the physical interaction and facilitate the heat conduction. This comes up to an idea of making use of carbon nanotubes (CNTs) as the active ingredients to prepare thermal grease. CNTs are reported to have excellent thermal (~6600 W/mK), electrical (~2000 S/cm) properties, and reasonably high stability, such materials may thus be a promising candi...
The friction at high speed and high pressure tends to cause the lowering of grease stickiness becaus...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materia...
Functionalized carbon nanotubes (CNTs) were introduced into silicone grease to accompany the s...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employ...
We developed carbon nanotube wires (CNWs) and monitored in situ their electrical properties at high ...
The use of 0.6 vol. % single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gav...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
With progress in microelectronics the component density on a device increases drastically. As a cons...
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are li...
International audienceWith progress in microelectronics the component density on a device increases ...
The friction at high speed and high pressure tends to cause the lowering of grease stickiness becaus...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materia...
Functionalized carbon nanotubes (CNTs) were introduced into silicone grease to accompany the s...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employ...
We developed carbon nanotube wires (CNWs) and monitored in situ their electrical properties at high ...
The use of 0.6 vol. % single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gav...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
With progress in microelectronics the component density on a device increases drastically. As a cons...
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are li...
International audienceWith progress in microelectronics the component density on a device increases ...
The friction at high speed and high pressure tends to cause the lowering of grease stickiness becaus...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materia...