In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total bus loading and have a significant impact on the power consumption. In this paper, we propose two reconfigurable bus encoding schemes, which are based on the correlation among the bit lines, to reduce the power consumption at the cross coupling capacitances of the instruction buses. The instruction is encoded by flipping and reordering the bit lines during compilation time to reduce the total switching capacitances. A crossbar is used to map back the data to the original instruction code before sending to the instruction decoder. The reordering can be re-configured during run-time by using different configurations in the crossbar. We propose...
Code compression techniques have been proposed to mitigate the problem of limited memory resources i...
[[abstract]]A crosstalk effect leads to increases in delay and power consumption and, in the worst-c...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
The use of deep-submicrometer (DSM) technology increases the capacitive coupling between adjacent wi...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
Power consumption is the most challenging design constraint in the future VLSI circuit design. In th...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
Code compression techniques have been proposed to mitigate the problem of limited memory resources i...
[[abstract]]A crosstalk effect leads to increases in delay and power consumption and, in the worst-c...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
The use of deep-submicrometer (DSM) technology increases the capacitive coupling between adjacent wi...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
Power consumption is the most challenging design constraint in the future VLSI circuit design. In th...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
Code compression techniques have been proposed to mitigate the problem of limited memory resources i...
[[abstract]]A crosstalk effect leads to increases in delay and power consumption and, in the worst-c...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...