In this paper, we experimentally explore the transient negative capacitance effect in ferroelectric high-k gate stacks using multi-ferroelectric domain Si-doped HfO2 with and without the metal plane, MFMIS (TiN/Si:HfO2/TiN/SiO2) and MFIS (TiN/Si:HfO2/SiO2), respectively. With optimized 500ns pulsed measurements, we compare the reconstructed transient S-shaped P-E curves of the two gate stacks using 100nm ferroelectric multi-domains and distinguish the non-switching hysteresis-free NC effect from unstable FE switching hysteretic phenomena. We experimentally validate that the use of a metal layer in between the ferroelectric and the dielectric can inherently destabilize NC due to domain formation. Furthermore, from P-E of both ferroelectric s...
To overcome the fundamental limit of the transistor subthreshold swing of 60 mV/dec at room temperat...
Because of the thermal distribution of electrons in a semiconductor, modern transistors cannot be tu...
textSince the invention of the integrated circuit in 1958, the semiconductor industry has progresse...
In this work, we experimentally explore and compare FET gate stacks with and without an inner metal ...
Conventional device scaling has been the main guiding principle of the MOS device engineering over t...
Ferroelectric Si: HfO2 has been investigated starting from metal-ferroelectric-metal (MFM) capacitor...
HfO2-based ferroelectrics are considered a promising class of materials for logic and memory applica...
Throughout the 22 nm technology node HfO2 is established as a reliable gate dielectric in contempora...
This letter reports for the first time a full experimental study of performance boosting of tunnel F...
The progress of state-of-art electronics requires CMOS technology to be more powerful and power effi...
Impact of physical parameters of ferroelectric layer on the performance of Negative Capacitance (NC)...
In this work, we propose and investigate the high performance and low power design space of non-hyst...
Steep slope negative capacitance MOSFETs with HfYOx ferroelectric on FDSOI were experimentally demon...
With the discovery of ferroelectric hafnium oxide (FE-HfO2), the ferroelectric field effect transist...
We report the fabrication of completely CMOS-compatible ferroelectric field-effect transistors (FETs...
To overcome the fundamental limit of the transistor subthreshold swing of 60 mV/dec at room temperat...
Because of the thermal distribution of electrons in a semiconductor, modern transistors cannot be tu...
textSince the invention of the integrated circuit in 1958, the semiconductor industry has progresse...
In this work, we experimentally explore and compare FET gate stacks with and without an inner metal ...
Conventional device scaling has been the main guiding principle of the MOS device engineering over t...
Ferroelectric Si: HfO2 has been investigated starting from metal-ferroelectric-metal (MFM) capacitor...
HfO2-based ferroelectrics are considered a promising class of materials for logic and memory applica...
Throughout the 22 nm technology node HfO2 is established as a reliable gate dielectric in contempora...
This letter reports for the first time a full experimental study of performance boosting of tunnel F...
The progress of state-of-art electronics requires CMOS technology to be more powerful and power effi...
Impact of physical parameters of ferroelectric layer on the performance of Negative Capacitance (NC)...
In this work, we propose and investigate the high performance and low power design space of non-hyst...
Steep slope negative capacitance MOSFETs with HfYOx ferroelectric on FDSOI were experimentally demon...
With the discovery of ferroelectric hafnium oxide (FE-HfO2), the ferroelectric field effect transist...
We report the fabrication of completely CMOS-compatible ferroelectric field-effect transistors (FETs...
To overcome the fundamental limit of the transistor subthreshold swing of 60 mV/dec at room temperat...
Because of the thermal distribution of electrons in a semiconductor, modern transistors cannot be tu...
textSince the invention of the integrated circuit in 1958, the semiconductor industry has progresse...