Crystal growth of electrolytic cu foil

Electrolytic copper deposited on (100)(Cu) single crystals forms pyramidal crystals that grow parallel to the substrate at low current density without stirring. With stirring and higher current density, slanting platelet crystals with (111)(Cu) orientation are formed. Chloride and gelatin are typical additives for electrolytic copper foils and the electrolytic copper foils are formed on a titanium substrate with a stirring rate and high current density. With gelatin, triangular pyramidal crystals form with (111)(Cu) orientation. The triangle-shaped side planes of the crystals are the (100)(Cu), and platelet crystals exist along the (100)(Cu). With chloride and gelatin, triangular columnar crystals with the (110)(Cu) orientation are formed. The triangle-shaped side planes of the crystals are the (100)(Cu) and the platelet crystals again exist along the (100)(Cu). These platelet crystals are bound by macrosteps, and they are the growth sites. The morphology of electrolytic copper foils on the titanium substrate does not change with higher current densities and stirring rates. It was also found that chloride changes deposit orientations in the concentration range of less than 10 ppm. (C) 2004 The Electrochemical Society.