Multi-materials assemblies bonded by a copolymer-filled epoxy resin

In order to reduce the weight of embedded systems, we have to achieve innovative materials and new assembly process, such as adhesive bonding between different materials (metals, composites, polymers). The assemblies should ensure a good transfer of stress (thermal, mechanical) over a wide range of temperature. The choice of the adhesive will be the key to succeed. Within this context, we propose to add some copolymers to the adhesive, these latter allowing us to tune the viscoelastic properties of the adhesive. The copolymers also ensure a high thermal and mechanical stability for the adhesive, enabling its use at high temperature without degradation, and low temperature without brittleness. This study will allow us to further the understanding of the mechanisms which modulate adherence at the interface polymers/substrates, which are yet to be understood, as well as their physical and chemical properties