Electrodeposited Ni–Co nanocrystalline thin films were grown onto indium tin oxide (ITO)-coated glass substrates from an electrolyte consisting of their sulfate salts and boric acid without stirring at ambient temperature. The effect of applied current density on the microstructural, compositional, magnetic, and morphological properties was investigated using different characterization techniques such as X-ray diffraction (XRD), energy dispersive X-ray (EDX) spectroscopy, vibrating sample magnetometer (VSM), and scanning electron microscopy (SEM). It was observed that the Ni content within the films increases as the applied current density increases. X-ray diffraction (XRD) analyses of Ni–Co films showed the formation of single p...
This project focuses on characterizing nickel-cobalt and nickel-cobalt-copper electrodeposited thin ...
Single Ni and Ni-Cu alloy films were electrodeposited on polycrystalline Ti substrates from electrol...
In this paper, we report micro-structural characteristics of electroplated Cu thin films with the va...
In this study, Ni–Cu films are grown on ITO (indium tin oxide) coated glass substrates by electrodep...
Nanocrystalline nickel (Ni) films were obtained by electrodeposition from chloride aqueous solution ...
In this research, nanocrystalline Ni-Fe-Cu ternary thin films using electrochemical deposition techn...
ABSTRACT Electrodeposition was used to deposit nanocrystalline Ni-Co-S alloy thin films on a copper ...
In this study, cobalt-nickel (Co-Ni) alloys were deposited electrochemically onto aluminum substrate...
A detailed study has been carried out to investigate the effect of applied current density on the co...
Electrode position in different current density was used to prepare nanostructure thin films of NiP....
The nickel and cobalt disperse alloy deposits of five different compositions were obtained by electr...
Environmentally friendly choline chloride/ethylene glycol-based deep eutectic solvent containing 0.2...
The magnetic and microstructural properties of Ni-Co films electrodeposited at different cathode pot...
The study presents investigations of an influence of various direct current densities on microstruct...
Composition, microstructure, and surface morphology of Ni-Cu alloy films electrodeposited at differe...
This project focuses on characterizing nickel-cobalt and nickel-cobalt-copper electrodeposited thin ...
Single Ni and Ni-Cu alloy films were electrodeposited on polycrystalline Ti substrates from electrol...
In this paper, we report micro-structural characteristics of electroplated Cu thin films with the va...
In this study, Ni–Cu films are grown on ITO (indium tin oxide) coated glass substrates by electrodep...
Nanocrystalline nickel (Ni) films were obtained by electrodeposition from chloride aqueous solution ...
In this research, nanocrystalline Ni-Fe-Cu ternary thin films using electrochemical deposition techn...
ABSTRACT Electrodeposition was used to deposit nanocrystalline Ni-Co-S alloy thin films on a copper ...
In this study, cobalt-nickel (Co-Ni) alloys were deposited electrochemically onto aluminum substrate...
A detailed study has been carried out to investigate the effect of applied current density on the co...
Electrode position in different current density was used to prepare nanostructure thin films of NiP....
The nickel and cobalt disperse alloy deposits of five different compositions were obtained by electr...
Environmentally friendly choline chloride/ethylene glycol-based deep eutectic solvent containing 0.2...
The magnetic and microstructural properties of Ni-Co films electrodeposited at different cathode pot...
The study presents investigations of an influence of various direct current densities on microstruct...
Composition, microstructure, and surface morphology of Ni-Cu alloy films electrodeposited at differe...
This project focuses on characterizing nickel-cobalt and nickel-cobalt-copper electrodeposited thin ...
Single Ni and Ni-Cu alloy films were electrodeposited on polycrystalline Ti substrates from electrol...
In this paper, we report micro-structural characteristics of electroplated Cu thin films with the va...