Vapor-based growth of thin metal films with controlled morphology on weakly-interacting substrates (WIS), including oxides and van der Waals materials, is essential for the fabrication of multifunctional metal contacts in a wide array of optoelectronic devices. Achieving this entails a great challenge, since weak film/substrate interactions yield a pronounced and uncontrolled 3D morphology. Moreover, the far-from-equilibrium nature of vapor-based film growth often leads to generation of mechanical stress, which may further compromise device reliability and functionality. The objectives of this thesis are related to metal film growth on WIS and seek to: (i) contribute to the understanding of atomic-scale processes that control film morpholog...
The mechanisms of phase formation in thin films have been studied in the Al-Cu, Al-Fe, Fe-Cu and Al-...
In order to develop a compact model for amorphous or microcrystalline silicon thin-film transistors ...
The solid state reaction between metallic thin films with a silicon substrate still needs to be inve...
Vapor-based growth of thin metal films with controlled morphology on weakly-interacting substrates (...
Le dépôt de matériaux à base de silice est largement utilisé dans de nombreux secteurs industriels, ...
Les films minces à base de cuivre sont un sujet d’actualité dans la communauté des sciences des maté...
In this study, we are interested in coatings of multiparticulate oral dosage forms for controlled dr...
In this study, we are interested in coatings of multiparticulate oral dosage forms for controlled dr...
The layer-by-layer method is a robust way of surface functionalization using a wide range of materia...
This work analyzes the organization of thin films of nematic liquid crystals on liquid substrates (w...
The constant shrinking of microelectronic devices requires the production of conformal and uniform n...
Among the noble metals, silver (Ag) presents the lowest electrical resistivity at low thickness, the...
Among the noble metals, silver (Ag) presents the lowest electrical resistivity at low thickness, the...
Titre de l'écran-titre (visionné le 27 septembre 2023)Avec le développement toujours croissant des s...
In order to develop a compact model for amorphous or microcrystalline silicon thin-film transistors ...
The mechanisms of phase formation in thin films have been studied in the Al-Cu, Al-Fe, Fe-Cu and Al-...
In order to develop a compact model for amorphous or microcrystalline silicon thin-film transistors ...
The solid state reaction between metallic thin films with a silicon substrate still needs to be inve...
Vapor-based growth of thin metal films with controlled morphology on weakly-interacting substrates (...
Le dépôt de matériaux à base de silice est largement utilisé dans de nombreux secteurs industriels, ...
Les films minces à base de cuivre sont un sujet d’actualité dans la communauté des sciences des maté...
In this study, we are interested in coatings of multiparticulate oral dosage forms for controlled dr...
In this study, we are interested in coatings of multiparticulate oral dosage forms for controlled dr...
The layer-by-layer method is a robust way of surface functionalization using a wide range of materia...
This work analyzes the organization of thin films of nematic liquid crystals on liquid substrates (w...
The constant shrinking of microelectronic devices requires the production of conformal and uniform n...
Among the noble metals, silver (Ag) presents the lowest electrical resistivity at low thickness, the...
Among the noble metals, silver (Ag) presents the lowest electrical resistivity at low thickness, the...
Titre de l'écran-titre (visionné le 27 septembre 2023)Avec le développement toujours croissant des s...
In order to develop a compact model for amorphous or microcrystalline silicon thin-film transistors ...
The mechanisms of phase formation in thin films have been studied in the Al-Cu, Al-Fe, Fe-Cu and Al-...
In order to develop a compact model for amorphous or microcrystalline silicon thin-film transistors ...
The solid state reaction between metallic thin films with a silicon substrate still needs to be inve...