This paper reports on fabrication of low-value embedded capacitors in conductive lithographic film (CLF) circuit boards. The CLF process is a low-cost and high speed manufacturing technique for flexible circuits and systems. We report on the construction and electrical characteristics of CLF capacitor structures printed onto flexible substrates. These components comprise a single polyester dielectric layer, which separates the printed electrode films. Multilayer circuit boards with printed components and interconnect can be fabricated using this technique
For high-speed integrated circuit applications, it is important to interconnect decoupling capacitor...
This paper summarizes an application-specific economic analysis of the conversion of discrete passiv...
d acting on its behalf, a paid-up, non exclusive, irrevomble worldwide license in works, dmnbute mpm...
This paper reports progress in the development of a novel fabrication technique for printing circuit...
Developments of advanced electronic products and the exploitation of new application fields for micr...
This paper describes the wafer level integration of coils, capacitors and resistors using copper / B...
Abstract- Embedded passives provide a practical solution to microelectronics miniaturization. In a t...
This paper presents fabrication of printed interdigital capacitors on a flexible and lightweight pol...
Technology development for embedding of passive components has been the subject of significant focus...
This paper proposes a novel technique for low cost circuit manufacture which it is hoped will offer ...
We report on a new low-cost manufacturing process for flexible displays that has the potential to ra...
This paper investigates the dielectric characteristics of the material used to make capacitor in fus...
Printed flexible circuits which combined conventional silicon technology will enable the realisation...
The use of thin-film transistors in liquid crystal display applications was commercialized about 30 ...
The ability to process and dimensionally scale field-effect transistors with and on paper and to int...
For high-speed integrated circuit applications, it is important to interconnect decoupling capacitor...
This paper summarizes an application-specific economic analysis of the conversion of discrete passiv...
d acting on its behalf, a paid-up, non exclusive, irrevomble worldwide license in works, dmnbute mpm...
This paper reports progress in the development of a novel fabrication technique for printing circuit...
Developments of advanced electronic products and the exploitation of new application fields for micr...
This paper describes the wafer level integration of coils, capacitors and resistors using copper / B...
Abstract- Embedded passives provide a practical solution to microelectronics miniaturization. In a t...
This paper presents fabrication of printed interdigital capacitors on a flexible and lightweight pol...
Technology development for embedding of passive components has been the subject of significant focus...
This paper proposes a novel technique for low cost circuit manufacture which it is hoped will offer ...
We report on a new low-cost manufacturing process for flexible displays that has the potential to ra...
This paper investigates the dielectric characteristics of the material used to make capacitor in fus...
Printed flexible circuits which combined conventional silicon technology will enable the realisation...
The use of thin-film transistors in liquid crystal display applications was commercialized about 30 ...
The ability to process and dimensionally scale field-effect transistors with and on paper and to int...
For high-speed integrated circuit applications, it is important to interconnect decoupling capacitor...
This paper summarizes an application-specific economic analysis of the conversion of discrete passiv...
d acting on its behalf, a paid-up, non exclusive, irrevomble worldwide license in works, dmnbute mpm...