This thesis consists of two parts. The first part presents an investigation of mechanical stress in silicon device structures processed with variations of the shallow trench isolation (STI) process. The measurements were performed with high spatial resolution using micro-Raman spectroscopy with ultra-violet (364 nm) laser light to excite the Raman scattering. This thesis describes in detail the advantages of UV over visible light excitation. The influence of different process parameters on the amount of mechanical stress introduced into the silicon substrate is presented. A correlation of mechanical stress levels with defect generation and degrading electrical properties is shown. The second part of this thesis presents an investigation of ...
We report Raman imaging of stress in a SiGe/Si optical channel waveguide structure. The difference i...
Strained silicon is applied to the transistor channel of leading-edge CMOS devices, significantly in...
Channel strain engineering is important for improving the performance of metal-oxide-semiconductor (...
This thesis consists of two parts. The first part presents an investigation of mechanical stress in ...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
THESIS 8388This work investigates the growth of several novel structures using a variety of spectros...
State-of-the-art electronic devices are nowadays well into the nanometer regime. Raman spectroscopy ...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Strained silicon underneath the field-effect transistor gate increases significantly the charge carr...
We report Raman imaging of stress in a SiGe/Si optical channel waveguide structure. The difference i...
Strained silicon is applied to the transistor channel of leading-edge CMOS devices, significantly in...
Channel strain engineering is important for improving the performance of metal-oxide-semiconductor (...
This thesis consists of two parts. The first part presents an investigation of mechanical stress in ...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
THESIS 8388This work investigates the growth of several novel structures using a variety of spectros...
State-of-the-art electronic devices are nowadays well into the nanometer regime. Raman spectroscopy ...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Laser micro-machining has proven to be a very powerful and successful tool for precision machining a...
Strained silicon underneath the field-effect transistor gate increases significantly the charge carr...
We report Raman imaging of stress in a SiGe/Si optical channel waveguide structure. The difference i...
Strained silicon is applied to the transistor channel of leading-edge CMOS devices, significantly in...
Channel strain engineering is important for improving the performance of metal-oxide-semiconductor (...