This thesis comprises the development, accuracy testing and application of the so-called nanoDAC method (nano Deformation Analysis by Correlation). The method combines scanning probe microcopy (SPM) images and digital image correlation (DIC) to derive an in-situ deformation measurement technique. The results are full-field 2D displacement fields with nanometer resolution. The method can be performed on bulk materials, thin films, and on microelectronic components. A thermosetting polymer material typically applied in microelectronics systems serves as an example to emphasize the capability of the method. Crack tip opening fields of a compact tension (CT) specimen are experimentally determined by means of nanoDAC and the obtained fields act ...
Ziel dieser Arbeit war es, neue Methoden in der Rasterkraftmikroskopie (SFM) zu entwickeln und an po...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approa...
This thesis comprises the development, accuracy testing and application of the so-called nanoDAC met...
Proceeding progress in miniaturization of electronic packages results in the need for experimental m...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
The authors present a new approach to deformation analysis based on localized correlation analysis o...
Recent advances in microelectronics and electronic packaging technology have led to a strong need in...
Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional m...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The paper presents a new reliability approach based on local stress and deformation analysis by mean...
Ziel dieser Arbeit war es, neue Methoden in der Rasterkraftmikroskopie (SFM) zu entwickeln und an po...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approa...
This thesis comprises the development, accuracy testing and application of the so-called nanoDAC met...
Proceeding progress in miniaturization of electronic packages results in the need for experimental m...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
Recent advances in microtechnology and the development of new electronics and micro/nanosystem devic...
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their b...
The authors present a new approach to deformation analysis based on localized correlation analysis o...
Recent advances in microelectronics and electronic packaging technology have led to a strong need in...
Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional m...
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano tech...
The paper presents a new reliability approach based on local stress and deformation analysis by mean...
Ziel dieser Arbeit war es, neue Methoden in der Rasterkraftmikroskopie (SFM) zu entwickeln und an po...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approa...