WOS: 000271352200021Zn-0.7 wt% Cu-hypoperitectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Unidirectional solidification of the Zn-0.7 wt% Cu-hypoperitectic alloy was carried out by using a Bridgman-type directional solidification apparatus under two different conditions: (i) with different temperature gradients (G = 3.85-9.95 K/mm) at a constant growth rate (41.63 mu m/s) and (ii) with different growth rate ranges (G = 8.33-435.67 mu m/s) at a constant temperature gradient (3.85 K/mm). The microstructures of the directionally solidified Zn-0.7 wt% Cu-hypoperitectic samples were observed to be a cellular structure. From both transverse and longitudinal sections of the samples, cellular spacing (lambda) and cell-ti...
In this work, the microstructural evolution of Zn–3.2 wt%Ag (hypoperitectic) and Zn–8 wt%Ag (hyperpe...
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
Zn-0.7 wt% Cu-hypoperitectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Un...
WOS: 000278825200004Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum...
10.1016/S1468-6996(01)00038-9Science and Technology of Advanced Materials21127-13
WOS: 000274947700006Zn-0.7wt.%Cu hypoperitectic alloys were directionally solidified upwards with di...
Transient directional solidification experiments have been carried out with Zn-Mg hypoeutectic alloy...
In the present work, the effect of growth rate and temperature gradient on microstructure and mechan...
In the present work, the effect of growth rate and temperature gradient on microstructure and mec...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
O desenvolvimento de microestruturas durante a solidificação de ligas peritéticas tem muito interess...
The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 a...
Although Zn–Sn alloys have suitable features for high temperature solders, as for example the absenc...
AbstractIn the present research the horizontal directional solidification of Zn-Sn alloys (Zn-4wt.%S...
In this work, the microstructural evolution of Zn–3.2 wt%Ag (hypoperitectic) and Zn–8 wt%Ag (hyperpe...
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
Zn-0.7 wt% Cu-hypoperitectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Un...
WOS: 000278825200004Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum...
10.1016/S1468-6996(01)00038-9Science and Technology of Advanced Materials21127-13
WOS: 000274947700006Zn-0.7wt.%Cu hypoperitectic alloys were directionally solidified upwards with di...
Transient directional solidification experiments have been carried out with Zn-Mg hypoeutectic alloy...
In the present work, the effect of growth rate and temperature gradient on microstructure and mechan...
In the present work, the effect of growth rate and temperature gradient on microstructure and mec...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
O desenvolvimento de microestruturas durante a solidificação de ligas peritéticas tem muito interess...
The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 a...
Although Zn–Sn alloys have suitable features for high temperature solders, as for example the absenc...
AbstractIn the present research the horizontal directional solidification of Zn-Sn alloys (Zn-4wt.%S...
In this work, the microstructural evolution of Zn–3.2 wt%Ag (hypoperitectic) and Zn–8 wt%Ag (hyperpe...
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...