"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out latent defects, which are not activated during normal testing of the VLSI devices. The devices are kept at a specified high temperature, for a specified period, in static or dynamic conditions. Since this method is cumbersome, an alternate method based on complementary metal oxide semiconductor (CMOS) signal switching for VLSI devices is considered. The majority of power dissipation in CMOS circuitry is due to the switching current associated with charging and discharging of load capacitances. Hence, if the test vectors can be so designed that maximum activity is conjured, the stress on the device can be maximised. In this paper, a new a...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
The cost of Burn-In is a major concern for the testing of Automotive Systems-on-Chip (SoCs). This pa...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out latent ...
As the complexity of VLSI circuits increases, the semiconductor manufacturers progress towards in-si...
Yield and reliability are two key factors affecting costs and profits in the semiconductor industry....
State transition of nodes in the circuit generates heat which usually needs to be minimized for reli...
Yield and reliability are two factors affecting the profitability of semiconductor manufacturing. Hi...
[[abstract]]Burn-in test is helpful to improve the reliability of Integrated Circuit (IC). It can sc...
Burn-In equipment provide both external and internal stress to the device under test. External stres...
Towards the requirement on input patterns of logic circuits for dynamic burn-in application, this pa...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
The cost of Burn-In is a major concern for the testing of Automotive Systems-on-Chip (SoCs). This pa...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
"Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out laten...
Burn-in is a well-known technique that helps to accelerate failure mechanisms to surface out latent ...
As the complexity of VLSI circuits increases, the semiconductor manufacturers progress towards in-si...
Yield and reliability are two key factors affecting costs and profits in the semiconductor industry....
State transition of nodes in the circuit generates heat which usually needs to be minimized for reli...
Yield and reliability are two factors affecting the profitability of semiconductor manufacturing. Hi...
[[abstract]]Burn-in test is helpful to improve the reliability of Integrated Circuit (IC). It can sc...
Burn-In equipment provide both external and internal stress to the device under test. External stres...
Towards the requirement on input patterns of logic circuits for dynamic burn-in application, this pa...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...
The cost of Burn-In is a major concern for the testing of Automotive Systems-on-Chip (SoCs). This pa...
A new algorithm for test-vector-generation (TVG) for combinational circuits has been presented for ...