Copper patterning on dielectrics by laser writing in liquid solution

A technique suitable for laser induced deposition of copper on LiNbO 3 and glass is presented. Deposition is achieved from Cu salt solution mixed with glycerol, after coating the surface with a very thin metal film. High resolution and low electrical resistivity can be achieved, using laser power levels in the 20-mW range. The technique can be used for electrode and interconnect fabrication in integrated optical devices, as well as mask repair or microelectronics applications