A lot of research is being done in the field of Photonic Integrated Circuits (PICs) for use in telecom, datacom, optical sensing and visible light applications. Optical packaging of these PICs is still a challenge; increasing complexity leads to a higher number of interconnects and, combined with the need for sub-micrometer accuracy, this places a significant burden on the overall packaging costs. One proposed method of optical packaging of multichannel PICs focusses on the alignment of waveguides using an actuator integrated into the waveguide beam. The waveguide itself consists of a small silicon nitride core surrounded by a thick silicon oxide cladding (TriPleX). Typical dimensions for these waveguide beams are 16 ?m in thickness and wid...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexibl...
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for ...
<p>This paper reports on the progress related to a multichannel photonic alignment concept, aiming f...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
The integration of optical components with polysilicon surface micromechanical actuation mechanisms ...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexibl...
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for ...
<p>This paper reports on the progress related to a multichannel photonic alignment concept, aiming f...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
This paper describes the design, fabrication and characterization of electrothermal bimorph actuator...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
The integration of optical components with polysilicon surface micromechanical actuation mechanisms ...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...
Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, ...