A Study Of Dedicated Production Configuration Of Multi-Chip Packaging Process

[[abstract]]本論文應用在製品投料（Work in process）管制與投單速率（Arrival rate）等條件併存狀態，尋求系統的適當生產配置（Production configuration）之模式與解析方法。研究成果分成三部分；首先，以封裝產業前段製程之黏晶（Die-attaching）站與銲線（Wire-bonding）站作為研究對象，並考量產品種類設計差異、規格限制多元與機台設備資源分配等因素，探討機台整備次數（Setup count）、總流程時間（Process flow time）以及專用機（Dedicated machines）與通用機（General machine）之配置等評估目標，因而解決生產過程中之迴流製程（Re-entrant process）所造成產品製造瓶頸問題。 第二部分詳述產線同時兼顧因不斷發展新型態產品對於通用機的需求以及因量產品對於專用機的仰賴之配置模式（產出量最大化、機台設備利用率最大化、整備次數最小化、在製品數量最佳化、以及總流程時間最小化），並從分析結果探討量產的維持運作與訂單（產出）的持續提升之最適條件以及可縮短產品的生產週期之有效因素。第三部分是以系統模擬軟體Arena建構一套針對多IC封裝（IC-package）前段（黏晶與銲線）製造排程之分析模組，並以五種產品組合、四種機台配置設定情況以及封裝製程特性（以此作為變動參數）等變異納入模擬條件中，提供後續設計人員進行相近研究時之參考依據。 最後，本研究從評估目標受到相關參數之影響程度比較得知，當系統選擇為在製品投料管制與機台數量極少狀態之條件時，此時的在製品數量雖有些微增加，但黏晶通用機之整備次數、總流程時間、以及黏晶與銲線專用機之使用率等有最大數值，此即專線（產線）進行多晶片封裝製造配置之最佳結果。本研究亦驗證，當專用機與通用機台數量經適量調配後使系統整體之效能提升，同時提供實驗研究成果讓製程與設計相關人員以及生產管理者在進行決策時有據可循。[[abstract]]This work presents a simulation result and analytical mode using WIP (work in process) control and arrival rate to investigate an optimization on a dedicated production configuration of multi-chip package This work is composed of three parts The first part describes the mainly object whose studies include the die-attaching and wire-bonding processes built in the preceding fabrication of IC-package industry According to the difference on both the product design and the limit of the multi-specifications as well as the differental allocation of resources on equipment an analytical mode is developed to integrate the machine setup counts the process flow times and the dedicated machine allocations in a predictable production scheduling system Therefore a fabrication bottleneck problem emerged from an issue of re-entrant process in IC-package manufacture is solved The second part introduces how to investigate both the requirements on the general machines for developing the new type products and the allocation modes on the dedicated machine for mass production From the study results to know a most appropriate condition can be predicted with respect to that the product quantities and its order are continually increased as well as the production cycle time is also fully reduced and controlled In the third part a package software Arena for simulating the system operations is used to construct an analytical mode for manufacturing scheduling the products with multi-chip package The analytical mode considers five kinds of product type four machine allocations and all characteristics of IC-package fabrication The analytical results are regarded as a good reference for the designers who will investigate the similar cases At last from the comparisons between analytical data with respect to all parameters it is known a good result on production configuration to fabricate the multi-chip product when the system considers both WIP control and minimum number of machine At the same time in spite of that the product quantities on WIP is little to increase the system has the maximum value in the setup count of the general machines for die-attaching the process flow time as well as the utilization rate of the dedicated machines for both die-attaching and wire-bonding fabrication This work is also to verify the system efficiency is enhanced when the quantities of the general and dedicated machines are allocated Furthermore the final results provide the evidences and references to let the process designers and the production supervisor to make the strategic importane decisio