Selection of Material Supply Models in Semiconductor Industry Considering Supply Chain Characteristics and Production Environment

[[abstract]]半導體產業經歷了三次的產業變革，使得整個產業形成垂直整合與垂直分工二種供應鏈模式。由於半導體垂直整合的型態，已逐漸轉為由專業IC設計、晶圓製造、及封裝廠形成的外包垂直分工型態，使得半導體封裝作業環境，由專屬封裝廠的計劃性生產，轉變為專業級封裝廠的接單式生產。為了快速回應客戶的需求，專業級封裝廠必須準備較高的原物料庫存。面對這樣的作業環境，半導體封裝廠不斷積極尋找有效降低庫存、避免材料呆滯的物料供應模式，以維持企業獲利能力。 本研究以創新擴散（Diffusion Of Innovations，DOI）模型為基礎，建立半導體封裝業的物料供應選擇模式。研究結果發現，新型態的物料供應模式如客戶寄存模式已成為半導體產業物料供應的趨勢，同時供應商管理庫存模式在半導體產業的實施比率也已大幅增加。 此外，依照問卷調查結果，發現影響物料供應模式選擇的重要因素依序為，「物料特性」、「認知利益」及「供應鏈特性」。至於「作業環境」並不是主要的決策考量因素，意味著生產與物流因素在半導體封裝業中，仍是容易被忽略的部份。[[abstract]]Semi-conductor industry has experienced three stages of revolution. Two types of supply chain models – vertical integration and vertical specialization – prevail in the industry. Shift from vertical integration model by IDM to vertical specialization model comprised of IC design (Fabless), Foundry and Assembly House has pushed production strategy of assembly house from Make-to-Plan (MTP) to Make-to-Order (MTO), which results in higher inventory levels. To reduce inventory while avoiding material shortage and keeping descent profit margin, it is crucial for the assembly house to choose a suitbale material supply model. The research is based on the theory of Diffusion of Innovations (DOI) to build up the selection behavior of material supply models. It is found that new types of material supply model such as Customer Consignment have gaining popularity; in the meantime the implementation ratio of Vendor Management Inventory was also increasing. It is also found that key selection factors for material supply models are material characteristics, benefits expected, and supply chain characteristics. Production environment is not among them, which implies that production and logistics issues are often neglected in Semi-conductor industry