Currently, in the era of big data and 5G communication technology, electromigration has become a serious reliability issue for the miniaturized solder joints used in microelectronic devices. Since the effective charge number (Z*) is considered as the driving force for electromigration, the lack of accurate experimental values for Z* poses severe challenges for the simulation-aided design of electronic materials. In this work, a data-driven framework is developed to predict the Z* values of Cu and Sn species at the anode based LIQUID, Cu6Sn5 intermetallic compound (IMC) and FCC phases for the binary Cu-Sn system undergoing electromigration at 523.15 K. The growth rate constants (kem) of the anode IMC at several magnitudes of applied low curr...
Chip-package interaction (CPI) is important for the reliability of advanced Cu/low k chips incorpora...
Electromigration-induced degradation in solder joints can be classified into two types, pancake-type...
Due to geometric scaling, the heterogeneous and anisotropic microstructures present in through-silic...
Currently, in the era of big data and 5G communication technology, electromigration has become a ser...
In Pb-free solder alloys used in solder balls of diameter of 50 µm or smaller, larger proportion of ...
As conventional lead solders are being replaced by Pb-free solders in electronic devices, the reliab...
In this work, we integrate different computational tools based on multi-phase-field simulations to a...
The high local temperature in flip-chip solder joints of microprocessors has raised concerns that th...
Abstract An efficient numerical method was developed to extract the diffusion and electromigration p...
Electrical discharge machining (EDM) is one of the non-traditional machining processes normally use...
In this study, the effects of electromigration on a solder/copper substrate due to temperature and c...
The material responses and the deformation pattern of crystals are strongly influenced by their micr...
The possibility of neuro-inspired computing with eNVMs has increased drastically within the last dec...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy join...
Chip-package interaction (CPI) is important for the reliability of advanced Cu/low k chips incorpora...
Electromigration-induced degradation in solder joints can be classified into two types, pancake-type...
Due to geometric scaling, the heterogeneous and anisotropic microstructures present in through-silic...
Currently, in the era of big data and 5G communication technology, electromigration has become a ser...
In Pb-free solder alloys used in solder balls of diameter of 50 µm or smaller, larger proportion of ...
As conventional lead solders are being replaced by Pb-free solders in electronic devices, the reliab...
In this work, we integrate different computational tools based on multi-phase-field simulations to a...
The high local temperature in flip-chip solder joints of microprocessors has raised concerns that th...
Abstract An efficient numerical method was developed to extract the diffusion and electromigration p...
Electrical discharge machining (EDM) is one of the non-traditional machining processes normally use...
In this study, the effects of electromigration on a solder/copper substrate due to temperature and c...
The material responses and the deformation pattern of crystals are strongly influenced by their micr...
The possibility of neuro-inspired computing with eNVMs has increased drastically within the last dec...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy join...
Chip-package interaction (CPI) is important for the reliability of advanced Cu/low k chips incorpora...
Electromigration-induced degradation in solder joints can be classified into two types, pancake-type...
Due to geometric scaling, the heterogeneous and anisotropic microstructures present in through-silic...