In this research work, a suite of approaches are presented to improve reliability of 3D heterogeneous processors (3DHP) and to reduce the area overhead of asynchronous designs. This work is primarily divided into two parts. In the first part, we present an approach for improving reliability in 3DHP. Typically, in 3DHP, thermal hotspots introduce spatial and temporal variability that results in wide bit error variation in DRAM dies. To address this issue multi- path BCH decoder is introduced. Based on the thermal gradient data generated by on-chip temperature sensors, the proposed methodology specializes in adaptively estimating the number of errors in the incoming word and also selecting the fast decoding path to correct these errors. Thus,...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
Historically, consumer computing products have moved to increasingly smaller form factors, from the ...
Reliability is a fundamental challenge for current and future microprocessors with advanced nanoscal...
A 3D heterogeneous processor (commonly termed as 3DHP) integrates multiple processor (such as CPU/GP...
3D heterogeneous processor (commonly termed as 3DHP) integrating multiple processor (such as CPU/GPU...
Journal ArticleAggressive technology scaling over the years has helped improve processor performanc...
Reliability is an important issue in very large scale integration(VLSI) circuits. In the absence of ...
Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3...
The pace of technological improvement of the semiconductor market is driven by Moore’s Law, enabling...
Reliability of logic circuits is emerging as an important concern that may limit the benefits of con...
The increasing power consumption in the synchronous circuits is the major concern in the semiconduct...
Technology scaling along with the process developments has resulted in performance improvement of th...
Historically, consumer computing products have moved to increasingly smaller form factors, from the ...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
As the semiconductor industry struggles to maintain its momentum down the path following the Moore's...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
Historically, consumer computing products have moved to increasingly smaller form factors, from the ...
Reliability is a fundamental challenge for current and future microprocessors with advanced nanoscal...
A 3D heterogeneous processor (commonly termed as 3DHP) integrates multiple processor (such as CPU/GP...
3D heterogeneous processor (commonly termed as 3DHP) integrating multiple processor (such as CPU/GPU...
Journal ArticleAggressive technology scaling over the years has helped improve processor performanc...
Reliability is an important issue in very large scale integration(VLSI) circuits. In the absence of ...
Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3...
The pace of technological improvement of the semiconductor market is driven by Moore’s Law, enabling...
Reliability of logic circuits is emerging as an important concern that may limit the benefits of con...
The increasing power consumption in the synchronous circuits is the major concern in the semiconduct...
Technology scaling along with the process developments has resulted in performance improvement of th...
Historically, consumer computing products have moved to increasingly smaller form factors, from the ...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
As the semiconductor industry struggles to maintain its momentum down the path following the Moore's...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
Historically, consumer computing products have moved to increasingly smaller form factors, from the ...
Reliability is a fundamental challenge for current and future microprocessors with advanced nanoscal...