Power rectifiers from electrical traction systems, but not only, can be irreversibly damaged if the temperature of the semiconductor junction reaches high values to determine thermal runaway and melting. The paper proposes a mathematical model to calculate the junction and the case temperature in power diodes used in bridge rectifiers, which supplies an inductive-resistive load. The new thermal model may be used to investigate the thermal behavior of the power diodes in steady-state regime for various values of the tightening torque, direct current through the diode, airflow speed and load parameters (resistance and inductance). The obtained computed values were compared with 3D thermal simulation results and experimental tests. The calcula...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
A simplified dynamic thermal analysis approach is proposed for the estimation of the peak junction t...
Power rectifiers from electrical traction systems, but not only, can be irreversibly damaged if the ...
Accurately predicting the temperature of semiconductor devices is very important in the initial desi...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
Accurately predicting the temperature of semiconductor devices is very important in the initial desi...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
In this paper, a new thermal model based on the Fourier series solution of heat conduction equation ...
The thermal analysis and management is an important issue for power semiconductor devices especially...
The thermal analysis and management is an important issue for power semiconductor devices especially...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
A simplified dynamic thermal analysis approach is proposed for the estimation of the peak junction t...
Power rectifiers from electrical traction systems, but not only, can be irreversibly damaged if the ...
Accurately predicting the temperature of semiconductor devices is very important in the initial desi...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
Accurately predicting the temperature of semiconductor devices is very important in the initial desi...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
In this paper, a new thermal model based on the Fourier series solution of heat conduction equation ...
The thermal analysis and management is an important issue for power semiconductor devices especially...
The thermal analysis and management is an important issue for power semiconductor devices especially...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The well-kno...
A simplified dynamic thermal analysis approach is proposed for the estimation of the peak junction t...