Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links
- Hsu, Shawn S.H.
- Li, Yan-Feng
- Wang, Hao-Ju
- Chen, Tai-Chun
- Tseng, Chih-Kuo
- Lee, M.
- Li, Ke
- Thomson, David J.
- Reed, Graham T.
Publication date
January 2017
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon modulator are addressed for high performance silicon-based transceiver front-end of optical link
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