VLSI/ULSI and the evolutions being driven by the International Technology Roadmap for Semiconductors (ITRS) are once again presenting severe challenges to the metal interconnect. Clock skew and other timing delays are becoming application critical design factors. The RC induced delays as well as parasitics (due to the trace density) are causing severe limitations to designs. Unfortunately these issues are very difficult to deal with using conventional computer aided design tools although efforts are being made, notably via DARPA funded programmes. We shall review techniques (and design elements) for on-chip optical communications. Through this we will present a new proposition for optical interconnects integrated upon otherwise conventional...
The challenges encountered while designing the silicon ASICs for three short reach optical interconn...
This paper discusses short-distance optical interconnects for general-purpose distributed digital sy...
In modern digital systems, off-chip and intra-chip electrical interconnections suffer from a multit...
The various arguments for introducing optical interconnections to silicon CMOS chips are summarized,...
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasing...
Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is sca...
The CMOS IC industry thrives on the down-scaling drive for ever smaller transistors, leading to fast...
Optics brings opportunities for addressing two key problems in electronic chips and systems – interc...
Abstract-The evolution of integrated circuit technology is causing system designs to move towards co...
The evolution of integrated circuit technology is causing system designs to move towards communicati...
Optics potentially addresses two key problems in electronic chips and systems: interconnects and tim...
This paper is focused on the latency and power dissipation in clock systems, which should be lower w...
The performance of future data processing systems will be set by interconnection limitations rather ...
This book provides a broad overview of current research in optical interconnect technologies and arc...
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking ...
The challenges encountered while designing the silicon ASICs for three short reach optical interconn...
This paper discusses short-distance optical interconnects for general-purpose distributed digital sy...
In modern digital systems, off-chip and intra-chip electrical interconnections suffer from a multit...
The various arguments for introducing optical interconnections to silicon CMOS chips are summarized,...
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasing...
Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is sca...
The CMOS IC industry thrives on the down-scaling drive for ever smaller transistors, leading to fast...
Optics brings opportunities for addressing two key problems in electronic chips and systems – interc...
Abstract-The evolution of integrated circuit technology is causing system designs to move towards co...
The evolution of integrated circuit technology is causing system designs to move towards communicati...
Optics potentially addresses two key problems in electronic chips and systems: interconnects and tim...
This paper is focused on the latency and power dissipation in clock systems, which should be lower w...
The performance of future data processing systems will be set by interconnection limitations rather ...
This book provides a broad overview of current research in optical interconnect technologies and arc...
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking ...
The challenges encountered while designing the silicon ASICs for three short reach optical interconn...
This paper discusses short-distance optical interconnects for general-purpose distributed digital sy...
In modern digital systems, off-chip and intra-chip electrical interconnections suffer from a multit...