Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the effects of Antimony (Sb) additions on the microstructure and tensile properties of the Sn-52 wt% Bi alloy are investigated. Various Sn-Bi(-Sb) samples solidified at different cooling rates and two levels of Sb-containing alloys allow a comprehensive examination of length scales of either dendritic or eutectic microstructures. A number of experimental techniques are used here to permit a sound analyses of the ternary Sn-Bi(-Sb) alloys: transient ...
In the present study, the effects of Ag and Bi additions (1 wt.%) on the microstructural, thermal, m...
The influence of 1wt% Sb2O3 nanoparticles addition on the microstructure and mechanical properties o...
Sn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified ...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
Considerable effort is being made to develop lead-free solders for assembling in environmental-consc...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
International audienceSn–Bi solders may be applied for electronic applications where low-temperature...
Over the past few years Sn-based solders containing third and fourth elements have become of great i...
Low-temperature, lead-free solders mitigate heating-induced warpage caused by the differences in c...
Low-temperature, lead-free solders mitigate heating-induced warpage caused by the differences in c...
Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature l...
In the present investigation a directional solidification experiment was performed in order to exami...
The present research aims to develop a theoretical/experimental analysis of the combined effects of...
Due to the inherent environmental and health toxicities associated with lead, the use of environment...
Horizontal directional solidification experiments were carried out with a monophasic Sn-2%Sb (mass f...
In the present study, the effects of Ag and Bi additions (1 wt.%) on the microstructural, thermal, m...
The influence of 1wt% Sb2O3 nanoparticles addition on the microstructure and mechanical properties o...
Sn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified ...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
Considerable effort is being made to develop lead-free solders for assembling in environmental-consc...
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Conselho Nacional de Desenvolvimento Ci...
International audienceSn–Bi solders may be applied for electronic applications where low-temperature...
Over the past few years Sn-based solders containing third and fourth elements have become of great i...
Low-temperature, lead-free solders mitigate heating-induced warpage caused by the differences in c...
Low-temperature, lead-free solders mitigate heating-induced warpage caused by the differences in c...
Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature l...
In the present investigation a directional solidification experiment was performed in order to exami...
The present research aims to develop a theoretical/experimental analysis of the combined effects of...
Due to the inherent environmental and health toxicities associated with lead, the use of environment...
Horizontal directional solidification experiments were carried out with a monophasic Sn-2%Sb (mass f...
In the present study, the effects of Ag and Bi additions (1 wt.%) on the microstructural, thermal, m...
The influence of 1wt% Sb2O3 nanoparticles addition on the microstructure and mechanical properties o...
Sn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified ...