Corrosion Resistance of Copper Surface Modified with(3-Mercaptopropyl) Trimethoxysilane in NaOH Solution

为了提高铜的耐蚀性,用自组装技术在铜表面上制备了3-巯基丙基三甲氧基硅烷(MPTS)自组装膜。利用红外光谱和扫描电子显微镜研究了该膜的结构,运用极化曲线和交流阻抗图谱等电化学方法考察了MPTS膜在0.5 mol/L NaOH溶液中对铜电极的缓蚀性能。结果表明,MPTS在铜表面可能以化学吸附方式强烈吸附到铜表面,同时在表面以Si-O-Si键自我交联形成了线性低聚物,MPTS浓度越高,其膜更致密。与裸铜电极相比,经MPTS修饰后的铜的腐蚀电位正移200mV,腐蚀电流降低一个数量级,其缓蚀效率为86.5%。Self-assembled monolayer film of(3-mercaptopropyl) trimethoxysilane(MPTS) was formed on electropolished surface to improve the corrosion resistance of copper.The structure of MPTS film was studied by using FTIR and SEM,and the inhibition effect of film was evaluated for copper in 0.5 mol/L NaOH solution using electrochemical linear polarization and AC impedance.The effects of deposit time and silane concentration were also discussed.The corrosion resistance of copper is improved markedly owing to the chemical absorption of MPTS on copper,and linear oligomer forms on the surface by cross-linking of Si-O-Si bonds.The higher is MPTS concentration,the more compact is the film.The corrosion potential of copper with MPTS film moves positive 200 mV,the corrosion current decreases an order of magnitude than that of blank copper,and the inhibition efficiency is 86.5%.MPTS monolayer retards the reduction of dissolved oxygen and inhibits the growth of copper oxide in the NaOH solution.福建省自然科学基金资助项目(E0210003