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C30

Toifur, Moh.

Publication date

May 2020

Publisher

Program Magister Pendidikan Fisika Program Pascasarjana Universitas Ahmad Dahlan

Language

English

Abstract

C30 berisi pengecekan similaritas paper berjudul “Deposition Time Variation On Thickness And Resistivity Of Cu/Ni Thin Fil Obtained By Magnetic Field-Assisted Electroplating Process

Extracted data

Related items

Effect of Deposition Voltage on Layer Thickness, Microstructure, Cu/Ni Sheet Resistivity of Deposition Results by Magnetic Field Electroplating Assisted Technique

Wijanarka, Willi Anindita
Toifur, Moh

May 2020

The purpose of this research is to make the Cu/Ni thin layer as an alternative to basic RTD material...

Toifur, Moh.

May 2020

rev9 berisi penilaian oleh reviewer 1 dan 2 tentang paper yan berjudul “The Effect Of Deposition Tim...

Toifur, Moh.

May 2020

REV35 berisi penilaian oleh reviewer 1 dan 2 tentang paper yanG berjudul: Microstructure, Thickness ...

PEER REVIEW_Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation

Saputra, Julius
Toifur, Moh.
Okimustava, Okimustava
Khusnani, Azmi

January 2020

Cu/Ni thin film has been made with an electroplating method assisted with a parallel magnetic field...

Toifur, Moh.

May 2020

C6 berisi pengecekan similaritas paper berjudul "Microstructure And Resistivity Of Cu Ni Cu Ni (T=30...

Toifur, Moh.

May 2020

C7 berisi pengecekan similaritas paper berjudul "Microstructure And Resistivity O f Cu Ni Thin Film ...

Toifur, Moh.

C9 berisi pengecekan similaritas paper berjudul "The Effect Of Deposition Time On The Microstructure...

Toifur, Moh.

May 2020

C31 berisi pengecekan similaritas paper berjudul “Thickness And Resistivities Of Cu/ Ni Film Result...

Toifur, Moh.

May 2020

C35 berisi pengecekan similaritas paper berjudul “Microstructure, Thickness And Sheet Resistivity Of...

Toifur, Moh.

C4 berisi pengecekan similaritas paper berjudul "The Effect Of The Magnetic Field To The Microstruct...

Peer Review_Microstructure And Resistivity Of The Electroplated Ni Aided By The Magnetic Field Parallel To The Electric Field On The Deposition Voltage Variation.

muhammad, ansarudin
Toifur, Moh.
Okimustava, Okimustava

January 2021

This research has developed Cu/Ni film aided by the magnetic field (B) to investigate the effects of...

Toifur, Moh.

May 2020

REV30 berisi penilaian oleh reviewer 1 dan 2 tentang paper yanG berjudul: Deposition Time Variation ...

Toifur, Moh.

C5 berisi pengecekan similaritas paper berjudul "Optimization Of Coil Parameters As A Candidate Of T...

Toifur, Moh.

C11 berisi pengecekan similaritas paper berjudul "The Effect of Electrolyte Concentration on The Sen...

Toifur, Moh.
Khusnani, Azmi
Okimustava, Okimustava

May 2020

C3 berisi pengecekan similaritas paper berjudul"Effect Of Mass Fraction Of Ni in Solution On The Mic...

Effect of Deposition Voltage on Layer Thickness, Microstructure, Cu/Ni Sheet Resistivity of Deposition Results by Magnetic Field Electroplating Assisted Technique

Wijanarka, Willi Anindita
Toifur, Moh

May 2020

The purpose of this research is to make the Cu/Ni thin layer as an alternative to basic RTD material...

Toifur, Moh.

May 2020

rev9 berisi penilaian oleh reviewer 1 dan 2 tentang paper yan berjudul “The Effect Of Deposition Tim...

Toifur, Moh.

May 2020

REV35 berisi penilaian oleh reviewer 1 dan 2 tentang paper yanG berjudul: Microstructure, Thickness ...

PEER REVIEW_Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation

Saputra, Julius
Toifur, Moh.
Okimustava, Okimustava
Khusnani, Azmi

January 2020

Cu/Ni thin film has been made with an electroplating method assisted with a parallel magnetic field...

Toifur, Moh.

May 2020

C6 berisi pengecekan similaritas paper berjudul "Microstructure And Resistivity Of Cu Ni Cu Ni (T=30...

Toifur, Moh.

May 2020

C7 berisi pengecekan similaritas paper berjudul "Microstructure And Resistivity O f Cu Ni Thin Film ...

Toifur, Moh.

C9 berisi pengecekan similaritas paper berjudul "The Effect Of Deposition Time On The Microstructure...

Toifur, Moh.

May 2020

C31 berisi pengecekan similaritas paper berjudul “Thickness And Resistivities Of Cu/ Ni Film Result...

Toifur, Moh.

May 2020

C35 berisi pengecekan similaritas paper berjudul “Microstructure, Thickness And Sheet Resistivity Of...

Toifur, Moh.

C4 berisi pengecekan similaritas paper berjudul "The Effect Of The Magnetic Field To The Microstruct...

Peer Review_Microstructure And Resistivity Of The Electroplated Ni Aided By The Magnetic Field Parallel To The Electric Field On The Deposition Voltage Variation.

muhammad, ansarudin
Toifur, Moh.
Okimustava, Okimustava

January 2021

This research has developed Cu/Ni film aided by the magnetic field (B) to investigate the effects of...

Toifur, Moh.

May 2020

REV30 berisi penilaian oleh reviewer 1 dan 2 tentang paper yanG berjudul: Deposition Time Variation ...

Toifur, Moh.

C5 berisi pengecekan similaritas paper berjudul "Optimization Of Coil Parameters As A Candidate Of T...

Toifur, Moh.

C11 berisi pengecekan similaritas paper berjudul "The Effect of Electrolyte Concentration on The Sen...

Toifur, Moh.
Khusnani, Azmi
Okimustava, Okimustava

May 2020

C3 berisi pengecekan similaritas paper berjudul"Effect Of Mass Fraction Of Ni in Solution On The Mic...

Effect of Deposition Voltage on Layer Thickness, Microstructure, Cu/Ni Sheet Resistivity of Deposition Results by Magnetic Field Electroplating Assisted Technique

Wijanarka, Willi Anindita
Toifur, Moh

May 2020

The purpose of this research is to make the Cu/Ni thin layer as an alternative to basic RTD material...

Toifur, Moh.

May 2020

rev9 berisi penilaian oleh reviewer 1 dan 2 tentang paper yan berjudul “The Effect Of Deposition Tim...

Toifur, Moh.

May 2020

REV35 berisi penilaian oleh reviewer 1 dan 2 tentang paper yanG berjudul: Microstructure, Thickness ...