Diamond/metal composites are very attractive materials for electronics because their excellent thermal properties make them suitable for use as heat sink elements in multifunctional electronic packaging systems. To enlarge the potential applications of these composites, current efforts are mainly focused on investigating different ways to improve the contact between metal and diamond. In the present work, a theoretical study has been carried out to determine the differences between the interfacial thermal conductance of aluminum/diamond and aluminum/graphite interfaces. Additionally, diamond particles were surface modified with oxygen to observe how it affects the quality of the diamond surface. The characterization of the surface of diamon...
Aluminum-diamond composites were produced using selective laser melting (SLM) from mechanically mixe...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
The increasing power density of electronic devices and components requires the development of new co...
The manuscript shows that nano-engineering the surface of diamond particles prior contacting the liq...
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, ...
The mainstream fabrication technologies and the key factors affecting their thermal conductivity of ...
In this study, Al/diamond composites were fabricated by the gas pressure infiltration method. The in...
This work consists in an experimental study of the main parameters governing the transport of heat a...
Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and ...
We have successfully fabricated highly densified aluminum (Al)-diamond composite materials by a simp...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
The effect of diamond surface treatment on the Thermal Boundary Conductance (TBC) between Al and dia...
The effects of processing conditions on the thermal conductivity (TC) of aluminum/diamond composites...
Diamond reinforced metals are being developed for use as highly sophisticated heat spreading materia...
Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sinte...
Aluminum-diamond composites were produced using selective laser melting (SLM) from mechanically mixe...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
The increasing power density of electronic devices and components requires the development of new co...
The manuscript shows that nano-engineering the surface of diamond particles prior contacting the liq...
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, ...
The mainstream fabrication technologies and the key factors affecting their thermal conductivity of ...
In this study, Al/diamond composites were fabricated by the gas pressure infiltration method. The in...
This work consists in an experimental study of the main parameters governing the transport of heat a...
Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and ...
We have successfully fabricated highly densified aluminum (Al)-diamond composite materials by a simp...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
The effect of diamond surface treatment on the Thermal Boundary Conductance (TBC) between Al and dia...
The effects of processing conditions on the thermal conductivity (TC) of aluminum/diamond composites...
Diamond reinforced metals are being developed for use as highly sophisticated heat spreading materia...
Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sinte...
Aluminum-diamond composites were produced using selective laser melting (SLM) from mechanically mixe...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
The increasing power density of electronic devices and components requires the development of new co...