Dependence of single vapor bubble dynamics and heat transfer rates on varying concentration of SiO2 nanoparticles for a range of subcooled conditions (0-9 degrees C) has been experimentally studied under nucleate pool boiling configuration. Non-invasive measurements have been carried out using rainbow schlieren deflectometry. Results on bubble dynamics showed that the bubble diameter and aspect ratio decrease with increasing subcooling levels as well as concentration of nanofluids. The frequency of bubble oscillations was found to increase first and then decrease with increasing subcooling levels while it decreases monotonically with increasing nanofluid concentration. Bubble departure frequency increased significantly for nanofluids, while...
A nanofluid is a colloidal suspension of nano-scale particles in water, or other base fluids. Previo...
Nucleate pool boiling of dilute water-silica nanofluid was numerically investigated using the two-fl...
Copyright © 2014 by ASME. The preferable cooling solution for micro-electronic systems could be forc...
The effect of nanoparticles on a single bubble-based nucleate pool boiling phenomenon under subcoole...
Bubble dynamics in pool boiling provides a suitable platform for researchers to understand the mecha...
Bubble dynamics of pool boiling of nanofluids has been experimentally investigated. The boiling surf...
The preferable cooling solution to the problem of thermal management of modern electronics for incre...
Abstract Infrared thermometry was used to obtain first-of-a-kind, time- and space-resolved data for ...
The heat transfer characteristics of silica (SiO2) nanofluids at 0.5 vol % concentration and particl...
The heat transfer characteristics of silica (SiO2) nanofluids at 0.5 vol % concentration and particl...
This work deals with a study of enhanced critical heat flux (CHF) and burnout heat flux (BHF) in poo...
The trends of decrease in size and increase in power dissipation for micro-electronic systems presen...
Nanofluid, a liquid suspension containing nanoparticles, has been widely used to enhance heat transf...
The advances in cooling microelectromechanical systems (MEMS) have led to extensive research efforts...
The heat transfer characteristics of silica (SiO(2)) nanofluids at 0.5 vol % concentration and parti...
A nanofluid is a colloidal suspension of nano-scale particles in water, or other base fluids. Previo...
Nucleate pool boiling of dilute water-silica nanofluid was numerically investigated using the two-fl...
Copyright © 2014 by ASME. The preferable cooling solution for micro-electronic systems could be forc...
The effect of nanoparticles on a single bubble-based nucleate pool boiling phenomenon under subcoole...
Bubble dynamics in pool boiling provides a suitable platform for researchers to understand the mecha...
Bubble dynamics of pool boiling of nanofluids has been experimentally investigated. The boiling surf...
The preferable cooling solution to the problem of thermal management of modern electronics for incre...
Abstract Infrared thermometry was used to obtain first-of-a-kind, time- and space-resolved data for ...
The heat transfer characteristics of silica (SiO2) nanofluids at 0.5 vol % concentration and particl...
The heat transfer characteristics of silica (SiO2) nanofluids at 0.5 vol % concentration and particl...
This work deals with a study of enhanced critical heat flux (CHF) and burnout heat flux (BHF) in poo...
The trends of decrease in size and increase in power dissipation for micro-electronic systems presen...
Nanofluid, a liquid suspension containing nanoparticles, has been widely used to enhance heat transf...
The advances in cooling microelectromechanical systems (MEMS) have led to extensive research efforts...
The heat transfer characteristics of silica (SiO(2)) nanofluids at 0.5 vol % concentration and parti...
A nanofluid is a colloidal suspension of nano-scale particles in water, or other base fluids. Previo...
Nucleate pool boiling of dilute water-silica nanofluid was numerically investigated using the two-fl...
Copyright © 2014 by ASME. The preferable cooling solution for micro-electronic systems could be forc...