The under-hood automotive ambient is harsh and its impact on electronics used in electronic control unit(ECU)assembly is a concern. The introduction of Euro 6 standard (Latest European Union Legislation)leading to increase in power density of power electronics in ECU has even amplified the device thermal challenge. Heat generated within the unit coupled with ambient temperature makes the system reliability susceptible to thermal degradation which ultimately may result in failure. Previous investigations show that the technology of thermal interface materials (TIMs) is a key to achieving good heat conductions within a package and from a package to heat sinking device. With studies suggesting that current TIMs contribute about 60% interfaci...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a pat...
International audienceWith progress in microelectronics the component density on a device increases ...
International audienceWith progress in microelectronics the component density on a device increases ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
With progress in microelectronics the component density on a device increases drastically. As a cons...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a pat...
International audienceWith progress in microelectronics the component density on a device increases ...
International audienceWith progress in microelectronics the component density on a device increases ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
With progress in microelectronics the component density on a device increases drastically. As a cons...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...