Evolution of anisotropic microstructure and residual stress in sputtered Cr films

A series of Cr films with varying thicknesses have been prepared using a multiple moving substrate deposition geometry. These films have been investigated with several experimental techniques, including synchrotron x-ray scattering, pole figures, electron microscope, and double crystal diffraction topography. It was found that the in-plane stresses are highly anisotropic in these Cr films. The anisotropic stresses, characterized by two principal stresses in two characteristic directions defined by the deposition geometry, are quantified based on a methodology given in the Appendix. The plan view transmission electron microscopy observations reveal that the Cr films develop well-organized microstructures. The grains, which are elongated along the radial direction, are crystallographically aligned as well. The development of crystallographic texture in the Cr films, further revealed by pole figures and azimuthal (ϕ) x-ray scans, depends on both the deposition geometry and the film thickness. The preferential orientation of film growth is [110] for thinner films (