A copper vapor laser (511 and 578 nm) is used to drill submillimeter diameter holes in 0.025–0.127 mm thick foils of copper, iron, and titanium. Foils are machined in atmospheric pressure air and argon. The laser is repetitively pulsed at 10 kHz with a per pulse energy of 0.5 mJ giving an average power of 5 W at the sample surface for a pulse width of 40 ns. A p‐i‐n photodiode and a photomultiplier tube detector are connected to a digital‐display timing circuit that records the number of incident laser pulses used to drill through the sample. The number of pulses is converted to an average drilling time and can provide an estimate for the average laser energy used to drill the hole. Typical data for all three materials with a per‐pulse flue...
This study aims to investigate the simulation of laser drilling processes on Inconel X-750 and Ti-5A...
The use of copper vapour lasers for laser ablation in laser materials processing applications is stu...
A growing appreciation has developed in the last several years for the copper vapor laser because of...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
A repetitively pulsed copper vapor laser (510 and 578 nm) is used to machine an opaque polymer (poly...
Aluminum foils with thickness ranging from 1.5 to 50 \u3bcm, and W, Mo, Ti, Cu, Fe, Ag, Au, and Pb f...
We report experimental results of drilling micro holes in Al, Mo, Ti, Cu, Ag, Au, and brass thin met...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
AbstractIn this paper laser beam micro ablation and drilling of metals, especially stainless steel a...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
In the last few years, commercially available ultrashort pulsed (usp) laser systems have reached ave...
This study aims to investigate the simulation of laser drilling processes on Inconel X-750 and Ti-5A...
The use of copper vapour lasers for laser ablation in laser materials processing applications is stu...
A growing appreciation has developed in the last several years for the copper vapor laser because of...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
A repetitively pulsed copper vapor laser (510 and 578 nm) is used to machine an opaque polymer (poly...
Aluminum foils with thickness ranging from 1.5 to 50 \u3bcm, and W, Mo, Ti, Cu, Fe, Ag, Au, and Pb f...
We report experimental results of drilling micro holes in Al, Mo, Ti, Cu, Ag, Au, and brass thin met...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at hi...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
AbstractIn this paper laser beam micro ablation and drilling of metals, especially stainless steel a...
The ability to laser machine materials with high resolution and high throughput is critical in advan...
In the last few years, commercially available ultrashort pulsed (usp) laser systems have reached ave...
This study aims to investigate the simulation of laser drilling processes on Inconel X-750 and Ti-5A...
The use of copper vapour lasers for laser ablation in laser materials processing applications is stu...
A growing appreciation has developed in the last several years for the copper vapor laser because of...