International audienceThis paper deals with an identification methodology of the interfacial fracture parametersto predict the lifetime of a metallic brazed joint. The methodology is based on an experimentalnumericalstudy whereby the optimal parameters are obtained. The experimental data, using thescanning electron microscope analysis, allowed approving that failure of the assembly based AuGesolder seems first to appear near the interfaces. These results were confirmed by micrographsanalysis of the solder/insert and solder/substrate interfaces. Then, using shear test results andparametric identification coupled with a finite elements model (FEM) simulation, the damageconstitutive law of the interfacial fracture based on a bilinear cohesive ...
The present thesis focuses on the development of numerical models capable of predicting reliably, wi...
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined u...
Simulation of crack growth in an interleaf bending specimen consisting of a metal interleaf bonded b...
This paper deals with an identification methodology of the interfacial fracture parameters to predic...
At the heart of any procedure for modelling and assessing the failure of dissimilar material brazed ...
The final publication is available at Elsevier via http://dx.doi.org/10.1016/j.engfracmech.2014.03.0...
At the heart of any procedure for modelling and assessing the design or failure of dissimilar materi...
Interfacial failure in adhesive joints has been studied. It has been shown by previous researchers t...
This paper deals with the application of Cohesive Zone Model (CZM) concepts to study mode I fracture...
International audienceThis work aims to establish a finite element model to simulate the behavior in...
An experimental investigation dealing with failure characterization of 63/37 solder-copper interface...
AbstractWith adhesive bonding, design can be oriented towards lighter structures, not only regarding...
A cohesive zone model (CZM) has been used in conjunction with both elastic and elastoplastic continu...
Adhesive bonding is a widely used joining method in industries such as aerospace, aeronautical and a...
Reliable predictive modelling of the environmental degradation of adhesively bonded structures is re...
The present thesis focuses on the development of numerical models capable of predicting reliably, wi...
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined u...
Simulation of crack growth in an interleaf bending specimen consisting of a metal interleaf bonded b...
This paper deals with an identification methodology of the interfacial fracture parameters to predic...
At the heart of any procedure for modelling and assessing the failure of dissimilar material brazed ...
The final publication is available at Elsevier via http://dx.doi.org/10.1016/j.engfracmech.2014.03.0...
At the heart of any procedure for modelling and assessing the design or failure of dissimilar materi...
Interfacial failure in adhesive joints has been studied. It has been shown by previous researchers t...
This paper deals with the application of Cohesive Zone Model (CZM) concepts to study mode I fracture...
International audienceThis work aims to establish a finite element model to simulate the behavior in...
An experimental investigation dealing with failure characterization of 63/37 solder-copper interface...
AbstractWith adhesive bonding, design can be oriented towards lighter structures, not only regarding...
A cohesive zone model (CZM) has been used in conjunction with both elastic and elastoplastic continu...
Adhesive bonding is a widely used joining method in industries such as aerospace, aeronautical and a...
Reliable predictive modelling of the environmental degradation of adhesively bonded structures is re...
The present thesis focuses on the development of numerical models capable of predicting reliably, wi...
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined u...
Simulation of crack growth in an interleaf bending specimen consisting of a metal interleaf bonded b...