Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of intentionally undoped and doped AlGaN/GaN heterostructures on Si and SiC substrates. An increase of the sheet carrier density ~up to ;30%! and a slight decrease of the electron mobility ~less than 10%! are found in all samples after passivation. The passivation induced sheet carrier density is 1.5– 231012 cm22 in undoped samples and only 0.731012 cm22 in 5–1031018 cm23 doped samples. The decrease of the electron mobility after passivation is slightly lower in highly doped samples. The channel conductivity in both types of unpassivated samples on Si and SiC substrates increases with an increase in doping density. After passivation, a well-resolved ...
The suppression of parasitic conductivity at the substrate/MBE regrowth interface in GaN/AlGaN heter...
International audienceThis paper presents a detailed characterization of 2D Electron Gas in AlGaN/Al...
For the determination of specific contact resistance in semiconductor devices, it is usually assumed...
peer reviewedConductivity and Hall effect measurements were performed before and after Si3N4 passiva...
Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of inten...
Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMT...
Intentionally undoped and three different, doped layer structures are used to investigate properties...
The transport properties of the two dimensional electron gas (2DEG) in AlGaNGaN heterostructures wit...
Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-dop...
Effects of the passivation of SiNx on the high temperature transport characteristics of the two-dime...
This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mob...
Electrical properties of AlxGa1-xN/GaN heterostructures with an Al content below 15% and carrier con...
Silicon nitride passivation on AlGaN/GaN heterojunction devices can improve performance by reducing ...
Initially, advances in the high frequency markets were begun by work in Gallium Arsenide systems. In...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
The suppression of parasitic conductivity at the substrate/MBE regrowth interface in GaN/AlGaN heter...
International audienceThis paper presents a detailed characterization of 2D Electron Gas in AlGaN/Al...
For the determination of specific contact resistance in semiconductor devices, it is usually assumed...
peer reviewedConductivity and Hall effect measurements were performed before and after Si3N4 passiva...
Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of inten...
Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMT...
Intentionally undoped and three different, doped layer structures are used to investigate properties...
The transport properties of the two dimensional electron gas (2DEG) in AlGaNGaN heterostructures wit...
Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-dop...
Effects of the passivation of SiNx on the high temperature transport characteristics of the two-dime...
This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mob...
Electrical properties of AlxGa1-xN/GaN heterostructures with an Al content below 15% and carrier con...
Silicon nitride passivation on AlGaN/GaN heterojunction devices can improve performance by reducing ...
Initially, advances in the high frequency markets were begun by work in Gallium Arsenide systems. In...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
The suppression of parasitic conductivity at the substrate/MBE regrowth interface in GaN/AlGaN heter...
International audienceThis paper presents a detailed characterization of 2D Electron Gas in AlGaN/Al...
For the determination of specific contact resistance in semiconductor devices, it is usually assumed...